Industry News | 2011-01-10 13:51:26.0
Juki Corporation announces that its KE-3020 features the company’s latest leading-edge technology for improved flexibility and production quality. The system supports both electronic and mechanical tape feeders and can handle boards up to 22” x 24". With its multi-nozzle (six nozzles) laser head, the KE-3020 can achieve a rated IPC9850 speed of 17,100 cph and is capable of a component placement range from 01005 (0402 metric) to 74mm2.
Industry News | 2022-10-06 18:08:43.0
Juki Automation Systems (JAS), Inc. today announced plans to exhibit at SMTA International, scheduled to take place Nov 2-3, 2022 at the Minneapolis Convention Center in Minnesota. Juki's team will be available to demonstrate the award-winning ISM UltraFlex 3600S, Incoming Material Station and RS-1R in Booth #731.
Industry News | 2014-04-07 17:34:26.0
SEHO Systems GmbHwill present these new developments in booth 9-209 at SMT/Hybrid/Packaging 2014, scheduled to take place May 6-8 in Nuremberg, Germany.
Industry News | 2018-10-18 09:44:09.0
How do I identify SMD components?
Industry News | 2018-10-18 09:21:56.0
RECENT SELECTIVE SOLDERING INDUSTRY TRENDS
Industry News | 2018-10-18 10:04:27.0
How to Decrease PCB Fabrication and Assembly Costs While Maintaining High Quality
Industry News | 2018-10-18 10:06:45.0
Design Decisions That Reduce Manufacturing Costs
Industry News | 2009-11-02 21:59:52.0
RANCHO SANTA MARGARITA, CA — November 2009 — Valor Computerized Systems, Inc., global provider of productivity improvement software across the printed circuit board manufacturing supply chain, announces that its manufacturer’ representative, Technical Resources Corp. and representatives from Valor will be on hand to discuss its manufacturing visibility and management software tools at the upcoming Space Coast SMTA Expo and Barbeque, scheduled to take place Wednesday, November 4, 2009 from 10 a.m.-3 p.m. at the Lagoon House Education Center in Palm Bay, FL.
Industry News | 2012-03-30 13:42:24.0
New technologies such as package on package (PoP) component assembly or bare die assembly on COB applications, as well as the optimization of material consumption demands for increased knowledge of the actual placement forces.
Industry News | 2001-06-15 15:37:28.0
FlexHybrid technology enables high-mix, high-throughput production
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