Industry News: pin and to and pad (Page 2 of 10)

World’s Premier Electronics Manufacturing Technical Conference Selects Best International and U.S. Papers Papers to be Presented at IPC APEX EXPO 2012

Industry News | 2012-02-23 14:43:13.0

IPC has announced the winners of the Best U.S. and International Papers of IPC APEX EXPO® 2012. Selected through a ballot process by the event’s Technical Program Committee, the papers will be presented at IPC APEX EXPO, February 28–March 1, at the San Diego Convention Center.

Association Connecting Electronics Industries (IPC)

IPC Membership in Europe Grows to More than 600 Company Sites Brussels office provides full suite of IPC products and services

Industry News | 2017-04-11 20:51:45.0

IPC membership in Europe has grown to an all-time high in 2017 with more than 600 member sites in 34 European countries. Last March, IPC opened an office in Brussels which delivers the full suite of IPC products and services, including member support, standards development activities, educational opportunities, public policy advocacy and more to all members in Europe. Brussels office staff are available to support IPC members in Europe in the major local languages and in their local time zone.

Association Connecting Electronics Industries (IPC)

Generic Custom Test Interface Fixture Rated to 2100 Vdc, CB8H For Panel- and Cable-Mounted Connectors, and LIF Test Blocks

Industry News | 2021-12-17 16:34:44.0

CAMI Research Inc. (Acton, MA), manufacturer of the CableEye® automation-ready cable and harness test system, has rolled out a test interface board that can be customized with LIF test blocks and any number of panel- and/or cable-mounted connectors not exceeding a total of 64 pins. Rated to 2100 Vdc/1200 Vdc, the CB8H fits all CableEye testers. Connectors not included. Customization service is available.

CAMI Research Inc.

Nordson DAGE to Bring Solutions for Live Imaging and Demanding Applications to SMT/Hybrid/Packaging

Industry News | 2013-03-20 10:54:36.0

Nordson DAGE, announces it will exhibit in Booth # 7-224 at the SMT/Hybrid/Packaging 2013 exhibition and conference, scheduled to take place April 16-18, 2013 at the Messezentrum in Nuremberg, Germany.

Nordson DAGE

Multitest’s Valts Treibergs and Chris Cuda to Present at BiTS 2010

Industry News | 2010-02-15 19:32:28.0

Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Valts Treibergs and Chris Cuda will present a paper titled “Spring Probe PCB Pad Wear Analysis” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/Mesa Hotel in Mesa, Ariz.

Multitest Elektronische Systeme GmbH

Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at IMAPS 2011

Industry News | 2011-09-12 11:53:55.0

Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #512 at the upcoming IMAPS 44th International Symposium on Microelectronics.

Nordson DAGE

Nordson DAGE to Exhibit Next-Generation Bond Testing and Inspection Technologies at ISTFA 2011

Industry News | 2011-10-16 00:05:15.0

Nordson DAGE will highlight its latest bond testing and X-ray inspection capabilities in Booth #326 at the upcoming International Symposium for Testing and Failure Analysis (ISTFA).

Nordson DAGE

Nordson DAGE to Exhibit Bond Test and X-Ray Solutions at SEMICON West 2012

Industry News | 2012-06-11 12:36:11.0

Nordson DAGE, announces it will exhibit in Booth #5971 North at the upcoming SEMICON West conference and exhibition, scheduled to take place July 10-12, 2012 at the Moscone Center in San Francisco, California.

Nordson DAGE

Digitaltest Brings Latest Hardware and Software Solutions to Apex 2011

Industry News | 2011-03-21 12:08:06.0

At Apex 2011 Expo in Las Vegas, Digitaltest Inc., a leader in electronic test hardware and software solutions for assembled printed circuit boards, will showcase its latest solutions in manufacturing and test technologies.

Digitaltest Inc.

Practical Components Adds Amkor's FusionQuad� Test and Thermal Cycle Boards to Its Lineup

Industry News | 2008-12-15 15:28:33.0

LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.

Practical Components, Inc.


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