Industry News: pre and heat and thermal and shock (Page 1 of 2)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Thermaltronics’ Tips to Improve Soldering Tip Life and Reduce Cost

Industry News | 2018-10-09 18:31:30.0

Whether in production, or repair and rework, the cost of soldering iron tips can be easily overlooked, but with today’s requirement for higher temperatures in lead-free solder applications, the consumption of tips has dramatically increased. This fact, combined with changes in tip design to meet the higher thermal load requirements, has also resulted in escalating tip costs, making tip care a high priority.

Thermaltronics USA, Inc.

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications

Industry News | 2014-09-05 13:53:06.0

AI Technology, Inc (AIT) Develops Temporary Bonding Wax for Precision Wafer and Substrate Back-grinding and Thinning Applications. AI Technology, Inc. (AIT) has recently developed a series of temporary wax-like media that has been proven to be useful in many of these thinning applications.

AI Technology, Inc. (AIT)

AI Technology, Inc. (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF)

Industry News | 2014-05-07 16:11:10.0

AI Technology (AIT) Releases Electrically and Thermally Conductive 20 Micron Wafer Level Die-Attach Film (DAF), Combines High Glass Transition Temperature and Stress Absorption with Proven Thermal Performance in Die-Attach Power Dissipation.

AI Technology, Inc. (AIT)

MacDermid Alpha to Launch ALPHA HiTechHigh Tg, Low CTEUnderfill and CornerfillBonding Materials

Industry News | 2021-01-17 17:50:26.0

The Assembly Division of MacDermid Alpha Electronics Solutions announces the release of ALPHA HiTechUnderfills and Cornerfills with high Transition Glass Temperature (Tg), Low Coefficient Thermal Expansion (CTE), and excellent thermal cycling (TCT) performance. The attributes provide formulation flexibility to enhance product performance in various applications.

MacDermid Alpha Electronics Solutions

MacDermid Alpha to Promote Latest Interconnect Technologies and Present on Microvia Reliability at the 2021 Virtual IPC APEX Exhibition and Conference

Industry News | 2021-02-25 13:41:10.0

MacDermid Alpha Electronics Solutions, leaders in innovative electronic interconnect technologies, will feature their recent product releases and latest innovations, at the IPC APEX Virtual Conference and Expo, March 8-12, 2021.

MacDermid Alpha Electronics Solutions

MARTIN to Demonstrate Affordable Rework System and Mini-Oven Reball/PreBump Unit at SMTAI 2011

Industry News | 2011-09-19 16:30:56.0

MARTIN will showcase its Mini-Oven Reball/Prebump unit and Expert 10.6 rework system in Booth #407 at the upcoming SMTA International Conference & Exhibition.

MARTIN (a Finetech company)

OK International will showcase assembly and rework technology advances at IPC/ APEX EXPO 2011

Industry News | 2011-03-17 17:48:27.0

The OK International team will display and demonstrate its full range of soldering and production assembly technologies at this year’s IPC/APEX Expo in Las Vegas, April 12-14. These industry-leading solutions will be fully operational at booth # 1634, including advanced soldering, desoldering and rework systems, programmable pre-heaters, fume extraction and a comprehensive range of dispensing technologies.

OK International

MARTIN to Demonstrate BGA Reball/Pre-Bump Unit at the SMTA Dallas and Houston Expo & Tech Forums

Industry News | 2011-02-17 14:59:07.0

MARTIN will showcase its Mini-Oven 04 Reball/Prebump unit at the upcoming SMTA Dallas and Houston Expo & Tech Forums. The SMTA Dallas Expo & Tech Forum is scheduled to take place Tuesday, March 1, 2011 at the Richardson Civic Center in Richardson, TX and the SMTA Houston Expo & Tech Forum is scheduled to take place Thursday, March 3, 2011 at the Stafford Centre in Stafford, TX.

Finetech

Parvus Announces Availability of Four Rugged Celeron-based Embedded Computers: SpacePC 1450, 1451, 1453, and 1850

Industry News | 2005-04-20 13:21:59.0

New PC/104-Plus SpacePC CPUs combine fanless -40C to +85C extended temperature operation with 256MB of soldered RAM for high reliability in mobile computing applications

Parvus Corporation

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