Industry News | 2017-06-05 15:45:06.0
YINCAE has developed a new innovative solder joint encapsulant paste. Designed to be used for mass production via dispensing or printing, SMT 256EP replaces traditional solder paste, flux, and underfill. SMT 256EP enhances solder joint strength by 5 to 10 times and has demonstrated high pull strength at both room and high temperatures (280°C).
Industry News | 2011-07-26 17:11:30.0
Nanovea introduced its patent pending breakthrough method of reliably acquiring yield strength through indentation; ultimately replacing the traditional tensile testing machine for yield strength measurement.
Industry News | 2018-05-08 13:42:49.0
SEMICON WEST 2018 is 1 month away! The tradeshow will take place at the Moscone Center in San Francisco, California, July 10 to 12. YINCAE hopes you will stop by our Booth 5269 to learn more about YINCAE and the innovative products we have to offer.
Industry News | 2021-02-24 11:47:14.0
YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.
Industry News | 2018-07-03 11:23:11.0
(Albany, NY) July 3, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is just one week away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.
Industry News | 2018-07-03 11:23:12.0
(Albany, NY) July 3, 2018 – SEMICON West 2018, North America’s premier Microelectronics event, is just one week away! The show will be held at the Moscone Center in San Francisco, CA from July 10th to 12th. YINCAE sincerely invites you to stop by our Booth #5269 to speak with our experts and to see what’s new.
Industry News | 2017-08-02 07:12:18.0
As market leader in bond testing, XYZTEC is pushing the technology forward. In this month's newsletter we highlight the recent advances in thin, 3D and MEMS die bond testing. As developments in thin die change the shape of our customers' products, three fundamental difficulties for the bond test have to be overcome:
Industry News | 2020-12-01 02:54:29.0
MacDermid Alpha Electronics Solutions announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.
Industry News | 2022-03-25 12:39:22.0
Since launching at the end of last year, Solderstar's innovative new thermal profiler 'SLX' has gone from strength to strength thanks to its innovative new additions which will be showcased during SMTconnect Nuremberg from 10-12 May 2022 Hall 4 Stand 226.
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