Industry News: quad qsp 2 (Page 5 of 14)

MIRTEC to premier its complete line of advanced AOI systems at IPC APEX EXPO 2011

Industry News | 2011-03-11 18:06:16.0

MIRTEC will feature an MV-7xi configured with the exclusive 15 Mega Pixel ISIS Vision System and proprietary 3D AOI technology in booth #1925 at the upcoming IPC APEX EXPO.

MIRTEC Corp

Count On Tools Introduces Quad 8mm Feeder Peel Roller

Industry News | 2010-07-20 13:41:03.0

Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces its new Quad 8mm Feeder Peel Roller (Blue Urethane), OEM PN# 30-15495 (Tyco #4-1567056-3).

Count On Tools, Inc.

Count On Tools Expands Its Quad Feeder Peel Roller Series

Industry News | 2011-04-20 15:54:05.0

Count On Tools Inc., a leading provider of precision components and SMT spare parts, has expanded its line of Quad Feeder Peel Rollers.

Count On Tools, Inc.

Automated IC Programming: 11 Package Types

Industry News | 2024-01-02 07:59:07.0

Explore the versatility of Automated IC Programming Systems, decoding a myriad of package types for precise and efficient electronics manufacturing.

I.C.T ( Dongguan ICT Technology Co., Ltd. )

SMTA International Technical Committee Announces Best Presentation & Papers Awards from the 2018 Conference

Industry News | 2019-01-30 08:13:02.0

The SMTA is pleased to announce the Best Papers from SMTA International 2018. As speakers at SMTA International, individuals make contributions to the industry by sharing their research and findings. For these exceptional achievements, a cash award and plaque are given to all winners.

Surface Mount Technology Association (SMTA)

IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest Offers Critical Information

Industry News | 2010-12-03 21:35:04.0

Eastern Europe's growing electronics assembly industry faces new challenges, especially with the adoption of lead-free technology. To connect manufacturers with solutions to these challenges, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.

Association Connecting Electronics Industries (IPC)

Registration Open for IPC’s Conference on Solderability and Reliability for Electronics Assemblies in Budapest Industry experts to present on technical and business issues

Industry News | 2012-12-17 19:16:10.0

IPC — Association Connecting Electronics Industries® announces registration is now open for the IPC Conference on Solderability and Reliability for Electronics Assemblies.

Association Connecting Electronics Industries (IPC)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

IPC International Conference in Budapest Highlights Process Steps for Manufacturing Quality Electronic Products

Industry News | 2011-01-22 00:27:29.0

Design, assembly, soldering, repair, rework, inspection, and materials choice are all variables to be juggled as electronics manufacturers worldwide work with new component types, high speed signals and lead-free technology. To assist them in making the best choices for producing reliable electronics, IPC — Association Connecting Electronics Industries® is holding the IPC Conference on Quality, Reliability and Acceptability for Electronics Manufacturing in Budapest, Hungary, on 22–24 February 2011.

Association Connecting Electronics Industries (IPC)

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)


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