Industry News: quad qsp 2 (Page 7 of 14)

ADLINK Introduces its First Quad-Core PXI Embedded Controller

Industry News | 2013-06-24 11:56:53.0

ADLINK Technology announced the introduction of its PXI-3980, ADLINK's first quad-core PXI embedded controller featuring the high-performance Intel® Core™ i7-2715QE 2.1 GHz processor, with up to 16 GB of 1333 MHz DDR3 memory, for seamless execution in multitasking environments and reduced test times.

ADLINK Technology, Inc.

ADLINK Announces Rugged SWaP-optimized 6U VPX Radar Solution

Industry News | 2014-07-10 21:52:16.0

ADLINK Technology today announced the VPX6000, a rugged 6U VPX blade featuring a dual processor design based on quad-core 4th generation Intel® Core™ i7-4700EQ processors. The VPX6000 is a high performance blade designed to meet MIL-STD-810F, for harsh environments and provide the high-availability required for mission critical applications, including radar, sonar, UAV and UGV in defense and aerospace.

ADLINK Technology, Inc.

Practical Components to Showcase Latest Technology in Representative AAT Aston GmBH Booth at Productronica 2009

Industry News | 2009-12-07 19:31:50.0

LOS ALAMITOS, CA - October 2009 —Practical Components, a leading international distributor of mechanical IC samples or “dummy” components and SMD production tools and equipment, announces that it will showcase its latest technology in representative AAT Aston GmbH’s booth in Hall A2, Stand 459 at the upcoming Productronica 2009 exhibition and conference, scheduled to take place November 10-13, 2009 at the New Munich Trade Fair Center in Munich, Germany.

Practical Components, Inc.

Saki Demonstrates 3D AOI Systems at NEPCON South China Booth 1G35

Industry News | 2016-08-28 13:28:32.0

Saki Corporation will demonstrate its 2D and 3D automated optical inspection (AOI) systems at NEPCON South China in booth 1G35. Saki's AOI systems' unique Phase Measurement Profilometry technology and quad-directional side cameras inspect and measure QFNs, J-leads, and connectors, and enable the detection of the most difficult defects, such as lifted leads, tombstones, reverses, and height variations, without a reduction in speed. NEPCON South China is being held August 30-September 1, 2016 at the Shenzhen Convention & Exhibition Center, Shenzhen, China.

SAKI America

Saelig Introduces Industrial Raspberry Pi Controller ComfilePi

Industry News | 2017-08-23 11:13:41.0

Versatile Raspberry Pi-based ComfilePi models CPi-A070WR and CPi-A102WR are housed and adapted for industrial use

Saelig Co. Inc.

New System-on-Module M100PFS Based on Microchip’s Low-power PolarFire SoC FPGA

Industry News | 2020-01-30 09:45:27.0

Embedded World 2020: ARIES Embedded Integrates Industry’s First Multi-Core RISC-V System-on-Chip FPGA

ARIES Embedded GmbH

PNC Inc. Acquires New 3D AOI System

Industry News | 2017-12-21 10:20:45.0

PNC Inc. has recently come to an agreement with MIRTEC to purchase the MV-6 OMNI 3D AOI System. To be used in their assembly division, this purchased has bolstered their state-of-the-art equipment list even further.

PNC Inc.

Reprint Services Appoints New Distributor for China and Hong Kong

Industry News | 2002-11-13 10:46:07.0

Reprint Services Appoints New Distributor for China and Hong Kong

Reprint Limited

Now Available ThinPRO Electronic Tape Feeder

Industry News | 2008-04-29 22:07:26.0

Introducing Tyco Electronics latest 8mm thin profile feeder.

Precision Placement Machines, Inc.

ADLINK Releases SMARC Module LEC-BT Running Intel® Atom™ Processor E3800 Series System-on-Chip

Industry News | 2014-07-23 13:15:08.0

ADLINK Technology today introduces a new SMARC form factor computer-on-module running on Intel x86 processors. Using a single, dual, or quad core Intel® Atom™ processor E3800 series system-on-chip from 1.3 to 2.2 GHz with soldered memory up to 4GB DDR3L at 1066/1333 MHz including ECC, the ADLINK LEC-BT product delivers top-of-the-line performance in efficient power use that targets a new generation of mobile applications with industrial-grade stability and reliability.

ADLINK Technology, Inc.


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Thermal Transfer Materials.