Industry News: recommendation (Page 1 of 41)

Henkel Names New Global Sales Director for Semiconductor Materials

Industry News | 2009-02-02 18:48:47.0

Henkel today announced the appointment of Mr. Luc Godefroid as the company's Global Sales Director for its Semiconductor Group. A key member of Henkel's electronics sales team since 2001, Godefroid's new role sees him building on his previous success and directing the global sales efforts of Henkel's worldwide team and expanded product portfolio.

Heller Industries Inc.

More Light from Smaller LEDs

Industry News | 2003-04-23 08:21:34.0

Rohm has a new series of ultrasmall high-brightness side-emitting chip LEDs that use built in reflectors and lenses to deliver optimum luminous intensity from minimal PCB footprint and power drain.

SMTnet

RSI's eSight Design for Manufacturability Solution Lowers PCB Manufacturing and Implementation Costs

Industry News | 2003-02-13 08:11:45.0

eSight Can Reduce Time-to-manufacture and Time-to-market by as Much as 80%

SMTnet

NEMI Launches DPMO Project

Industry News | 2003-05-02 08:49:07.0

Group to Assemble Data by Package and Technology Type

SMTnet

Baja Bid Online SMT Exchange Auction to Kick off Event August 27, 2013 Through August 29, 2013

Industry News | 2013-08-27 13:14:25.0

Baja Bid, a leading host for online SMT exchange auction events, is kicking off another sale of used SMT, assembly, and remanufactured SMT equipment.

Baja Bid

One-third of Printed Boards for U.S. Military Electronics are Made Outside North America

Industry News | 2011-05-12 22:22:56.0

A market analysis prepared for the U.S. Air Force by IPC — Association Connecting Electronics Industries® shows an estimated one-third of all printed circuit boards (PCBs) for U.S. defense or military systems are produced outside North America.

Association Connecting Electronics Industries (IPC)

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Non-IC Electronic Components Covered in Latest Update of JEDEC and IPC Quality and Reliability Standard for SMDs

Industry News | 2012-02-07 00:45:44.0

IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.

Association Connecting Electronics Industries (IPC)

IPC Board Chairman Steve Pudles Testifies Before Congress Urges Changes to SEC Proposed Rule on Conflict Minerals

Industry News | 2012-05-10 19:53:59.0

IPC is advocating changes to the draft SEC rule implementing Section 1502 of the Dodd-Frank Act that would lessen the burden on small manufacturing companies

Association Connecting Electronics Industries (IPC)

IPC Board Chairman Steve Pudles Testifies Before Congress Urges Changes to SEC Proposed Rule on Conflict Minerals

Industry News | 2012-05-10 19:54:00.0

IPC is advocating changes to the draft SEC rule implementing Section 1502 of the Dodd-Frank Act that would lessen the burden on small manufacturing companies

Association Connecting Electronics Industries (IPC)

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