Industry News | 2008-04-08 23:53:03.0
MORRISVILLE, NC - April 2008 - Juki Corporation, a world-leading provider of automated assembly products and systems, announces that it won a 2008 SMT China Vision Award for its OPASS technology in the Software - Production category during an awards ceremony that took place April 8, 2008 at the Shanghai Everbright Convention & Exhibition International Hotel during NEPCON China/EMT China. OPASS, which stands for Offset Placement After Solder Screen Printing, was developed to address the problem of solder paste alignment errors.
Industry News | 2009-12-07 18:55:54.0
Solothurn, Switzerland - October2009 - JUKI, a world-leading provider of automated assembly products and systems, announces that it will highlight its latest line-up of brand new and tried and tested Chipshooters, Flexible Mounters, Intelligent feeders and Software in Hall A3, Stand 143 of the Productronica exhibition. The event is scheduled to take place 10th – 13th November 2009 at the New Munich Trade Fair Center in Munich, Germany.
Industry News | 2022-11-15 12:33:16.0
SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.
Industry News | 2018-08-14 17:57:21.0
Saki Corporation introduces Saki Self-Programming Software, the first self-programming software for solder paste inspection (SPI) and automated optical inspection (AOI) equipment. Saki Self-Programming (SSP) software, installed on Saki's 3D SPI and 3D AOI systems, makes programming fast, easy, and doesn't require any special programming skill or training. All you need is the Gerber and centroid CAD data. The software does the rest.
Industry News | 2007-08-02 17:44:00.0
ePSeries Printers at SMTAI Booth#329 and Nepcon East# 723
Industry News | 2020-07-14 15:55:46.0
Mycronic US is pleased to announce that all of its operations have been successfully integrated into a new state-of-the-art, 102,000 square-foot facility in Tewksbury, near Boston, Massachusetts. This brings together under one roof the Global Technologies division comprising of MRSI Systems and AEi and the US operations of Mycronic's High Flex division.
Industry News | 2021-08-26 11:02:27.0
SHENMAO America, Inc.'s Joint Enhanced Solder Paste (JEP) PF606-EP305 offers the advantages of both conventional solder paste and anisotropic conductive paste, i.e., self-alignment and planar insulation, respectively. JEP enables soldering and joint encapsulation in one step reflow.
Industry News | 2009-09-09 20:07:33.0
Henkel Corporation today announced that the United States Patent and Trademark Office (USPTO) has allowed a patent covering its Ablestik® Self-Filleting® die attach products and controlled flow technique, which have been designed and perfected by the company over the past five years.
Industry News | 2011-03-23 15:36:29.0
Multitest announces that its MT2168 pick-and-place handler offers significant yield advantages based on its unique and industry-leading positioning concept.
Industry News | 2019-11-12 12:13:06.0
Reduces Cost of Programming for 30- to 90-Second Programming Time MCUs and Flash Devices
