Industry News | 2013-09-30 16:09:37.0
The inaugural IPC APEX India™ conference and exhibition was held 26–29 August at the NIMHANS Convention Centre in Bangalore, India.
Industry News | 2018-12-08 03:24:24.0
RoHS Guide in Electronics: RoHS, WEEE and Lead-Free FAQ
Industry News | 2018-10-18 10:46:06.0
What are the Steps in the Manual and Automated SMT Assembly?
Industry News | 2012-02-07 00:45:44.0
IPC and JEDEC have released the C revision of IPC/JEDEC J-STD-033, Handling, Packing, Shipping and Use of Moisture/Reflow and/or Process Sensitive Components. With an expanded scope, the document now covers the handling, packing and shipping of non-IC electronic components that have been classified per EIA/IPC/JEDEC J-STD-075, Classification of Non-IC Electronic Components for Assembly Processes.
Industry News | 2013-01-02 16:01:34.0
A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components
Industry News | 2013-06-10 12:19:40.0
BTU International, Inc., will highlight its controlled atmosphere furnaces and convection reflow ovens in Booth #2622 in the South Hall at the 2013 SEMICON West exhibition & conference, scheduled to take place July 9-11, 2013, at the Moscone Center in San Francisco, CA.
Industry News | 2019-12-16 22:38:22.0
With a history of more than 28 years since 1990, icict has been committed to building the most influential and innovative ICT platform, providing comprehensive services, communication and cooperation opportunities, including policy interpretation, technology research and development, market application and financial investment, for the ICT industry chain.
Industry News | 2013-03-07 14:04:01.0
BTU International, Inc.will showcase its new DYNAMO™ solder reflow oven in booth #D60 at the 27th International Electrical, Energy and Automation Industry Fair (FIEE), scheduled to take place April 1-5, 2013, at the Anhembi Exhibition Centre, in Sao Paulo, Brazil.
Industry News | 2003-05-05 08:32:30.0
Nepcon UK in Brighton will host the latest in electronics materials and electronics reliability measurement equipment from Concoat.
Industry News | 2021-10-07 15:10:50.0
KIC will exhibit in Booth #3101 at SMTA International, scheduled to take place Nov. 3 - 4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Along with Reflow Process Inspection (RPI) and Wave Solder Process Inspection (WPI), the KIC team will discuss NPI setup, process optimization for reduced defects, improved OEE, and their complete ecosystem of solutions for thermal processes.
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