Industry News: reflow component spacing (Page 1 of 162)

For Electronics, Phoenix Contact has Professional Housings

Industry News | 2003-06-03 08:20:48.0

Designed for fast and easy DIN-rail mounting

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SMTA INTERNATIONAL FT WORTH

Industry News | 2011-11-03 21:52:00.0

By davef: I was fortunate to be able to attend the SMTAI Exhibition Oct. 18-19, 2011. While I was walking around looking at the booths and talking to the exhibitors, I got this idea that I would report back on things that I found interesting. You know spread the news, since not everyone was there.

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DuPont Electronic Technologies Highlights Interra� Embedded Passives Technology at IPC Expo

Industry News | 2003-03-24 09:46:41.0

Will feature a number of new technologies of interest to fabricators in printed circuit materials, laminate materials, polymer thick films and, most notably, its newest product line of embedded passive materials, DuPont Interra�.

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REMEC Deploys AWR Design Flow Worldwide

Industry News | 2003-06-09 09:16:38.0

The adoption of AWR EDA software supports REMEC�s continuous efforts to manage the substantial challenges of today�s wireless design technology.

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University Pioneers Assembly Technolology

Industry News | 2003-03-28 08:24:43.0

The manufacture of electronic devices could be revolutionised thanks to assembly research being pioneered at the University of Greenwich.

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Terminal Blocks Handle the Hazards

Industry News | 2003-04-14 08:50:52.0

Providing connection facilities for PCBs designed to be used in hazardous areas is straightforward with Phoenix Contact's new range of Combicon Ex-approved printed circuit terminal blocks.

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New EMS, Lightspeed Manufacturing, Opens for Business

Industry News | 2003-03-11 08:16:17.0

Lightspeed has already shipped its first product, and has set up production in a new building with up to date facilities and equipment.

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Connector Range has Board-to-cable Options Covered

Industry News | 2003-03-13 08:19:18.0

The Flakafix 2.54mm grid IDC board-to-cable connector can now be supplied with a variety of terminations including surface mount, solder-in, press-fit and pin-in-paste.

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Fairchild Announces Industry's First SSOT-6 FLMP N-Channel MOSFETs

Industry News | 2003-05-22 08:36:27.0

Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability

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DPAC Technologies Strengthens Board of Directors with New Independent Board Member

Industry News | 2003-04-28 07:47:37.0

DPAC exceeds requirements of Sarbanes-Oxley Act in independence and financial expertise for the DPAC Technologies Board

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