Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Surface Mount Technology Association (SMTA)
Industry News | 2018-10-18 08:14:11.0
How to Prevent the Tombstone and Open Defects during the SMT Reflow Process
Industry News | 2012-01-22 23:16:58.0
More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.
Industry News | 2015-05-18 21:19:33.0
The SMTA Capital Chapter is pleased to announce it will welcome Denis Barbini, Universal Instruments Corporation, on June 9th to instruct a tutorial on Advanced SMT Technologies at ZESTRON Americas located at 11285 Assett Loop, Manassas, VA 20109. The tutorial is scheduled from 9:00 am to 4:30 pm and includes lunch. The following should attend: quality engineers, failure analysis engineers, reliability engineers, procurement specialists, design engineers, process engineers, project managers. Registration is required for this learning event.
Industry News | 2018-10-18 09:06:41.0
Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors
Industry News | 2014-01-07 18:55:28.0
Count On Tools Inc. (COT) worked closely with its customer, Nortech Systems, to eliminate board failures on the company’s screen printer line and improve the application process for future builds.
