Industry News | 2013-04-10 15:58:24.0
Nordson YESTECH has been selected by Mer-Mar, Inc., a full-service contract electronics manufacturer, as their AOI supplier. Nordson YESTECH’s BX benchtop AOI will be used for automated inspection of printed circuit boards at Mer-Mar’s 22,000 square foot facility, located in Hesperia, California.
Industry News | 2013-01-14 14:43:06.0
Essemtec, announces that it will showcase flexible Swiss-made solutions in Booth #3233 at the upcoming IPC APEX EXPO
Industry News | 2023-08-29 07:11:55.0
Indium Corporation® will showcase selections from its portfolio of proven products for thermal management and power electronics applications at SEMICON Taiwan, September 6‒8, in Taipei. In addition, Senior Area Technical Manager Jason Chou will deliver a presentation, The Lead-Free Materials Evolution in Power Die-Attach Soldering Applications, on September 7.
Industry News | 2017-11-07 17:14:32.0
Nordson Corporation (NASDAQ: NDSN) announces that eight divisions from its Advanced Technology segment will be exhibiting together at Productronica, the world's leading trade fair for electronics development and production, to be held in Munich, Germany during November 14-17, 2017, in Hall A2, stands 245, 345, and 445.
Industry News | 2019-09-15 16:55:59.0
KIC will exhibit in Booth #1218 at SMTA International, scheduled to take place Sept. 24-25, 2019 at the Stephens Convention Center in Rosemont, IL. The KIC team will discuss Industry 4.0 automation, traceability, NPI setup, machine verification, and more, all for your thermal processes; reflow, wave solder and cure.
Industry News | 2014-08-26 15:47:04.0
Vi TECHNOLOGY has appointed Rothmeier SMT Solutions to promote the sales of its complete product range to customers in Southern Germany.
Industry News | 2013-06-06 19:06:31.0
FCT Assembly today announced that it has secured an order from a fast-growing contract manufacturer (CM) in the Northwest.
Industry News | 2013-08-06 14:51:14.0
Data I/O Corporation (NASDAQ: DAIO) today announced Anthony Ambrose, President and CEO, will present at the upcoming Flash Memory Summit on best practices for programming Multi Level Cell (MLC) NAND memory devices.
Industry News | 2015-01-19 20:59:27.0
FCT Assembly today announced that it will present a new process for evaluating solder pastes in Booth #713 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Field application engineer, Tony Lentz, also will present the paper written on the new evaulation process titled “Dispelling the Black Magic of Solder Paste.” The presentation will be held during the Fluxes Technical Conference Session on Tuesday, Feb. 24 from 1:30-3 p.m.
Industry News | 2019-01-30 21:02:28.0
Hanwha Techwin Automation Americas today announced that it has received two 2019 NPI Awards in the categories of Component Placement – High-Speed for its HM520 Cutting-Edge Modular Mounter and Screen/Stencil Printing for the ESE US-2000XF. The awards were presented to the company during a Tuesday, Jan. 29, 2019 ceremony that took place at the San Diego Convention Center during the IPC APEX EXPO.
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