Industry News | 2018-10-18 08:00:40.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 08:01:00.0
SMT solder joint quality and appearance inspection process
Industry News | 2018-10-18 09:14:05.0
Lead-free processes propose new requirements on reflow soldering quality
Industry News | 2013-03-07 14:04:01.0
BTU International, Inc.will showcase its new DYNAMO™ solder reflow oven in booth #D60 at the 27th International Electrical, Energy and Automation Industry Fair (FIEE), scheduled to take place April 1-5, 2013, at the Anhembi Exhibition Centre, in Sao Paulo, Brazil.
Industry News | 2010-03-15 13:23:37.0
Rehm Thermal Systems has introduced new cooling zone designs for their Vision Series convection reflow ovens. The new technology is particularly effective for the homogenous cooling of large thermal mass PCBs.
Industry News | 2019-12-16 22:23:49.0
In recent years, the automotive industry headlights using LED, especially the of large power LED chip more and more. Especially in the headlamp part of the large hernia lamp with high-power high-power LED panel, the effect is very good.
Industry News | 2019-12-13 05:17:29.0
The position of laser in laser industry chain
Industry News | 2018-10-18 09:20:09.0
Product defects caused by the flux in the wave soldering process
Industry News | 2017-06-13 20:38:27.0
KIC announces plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 13, 2017 at the Embassy Suites Cleveland Rockside in Independence (Cleveland), OH. MB (Marybeth) Allen will showcase discuss how to turn your factory into a Smart Factory with KIC’s new SPS Smart Profiler reflow process inspection tool and all new KIC Vantage network insight software.
Industry News | 2017-05-01 15:24:14.0
KIC today announced plans to exhibit with SmartRep in booth 4A-230 at SMT Hybrid Packaging, scheduled to take place May 16-18, 2017 in Nuremberg, Germany. KIC’s representatives will showcase the new KIC SPS thermal profiler and Vantage network intelligence system.