Industry News: repair ic lifted lead (Page 1 of 6)

Stencil aperture considerations for QFN chips

Industry News | 2018-10-18 08:40:47.0

Stencil aperture considerations for QFN chips

Flason Electronic Co.,limited

How does PCB X-Ray Inspection Work?

Industry News | 2018-10-18 10:02:00.0

How does PCB X-Ray Inspection Work?

Flason Electronic Co.,limited

What is a Ball Grid Array?

Industry News | 2018-10-18 10:22:15.0

What is a Ball Grid Array?

Flason Electronic Co.,limited

Innovative Technology Center at IPC APEX EXPO Highlights Leading Edge Technologies.

Industry News | 2010-03-27 19:26:29.0

BANNOCKBURN, Ill., USA, - IPC - Association Connecting Electronics Industries® announces the products that will be featured in the Innovative Technology Center (ITC) at IPC APEX EXPO™, April 6–8, 2010, in Las Vegas. Assessed by an IPC Review Board of industry experts, the products were selected based on their representation of a new or emerging technology of significant value and relevance to the electronics manufacturing industry.

Association Connecting Electronics Industries (IPC)

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

New IPC 7711/7721 Rev. “C” The Rework and Repair of Electronic Assemblies – Focused IR

Industry News | 2017-01-15 19:24:33.0

PDR Americas, a leader in IR rework, test and inspection, is pleased to announce that the new IPC 7711/7721 Rev. C standard – The Rework and Repair of Electronic Assemblies – now includes focused infrared technology as a method for the removal and replacement of components. PDR offers the only systems on the market that have this technology.

PDR-America

EMS Introduces Dry Film Negative Photoresist for Sealing Through-Silicon Vias in CMOS Wafers

Industry News | 2018-03-08 18:44:09.0

Engineered Material Systems is pleased to introduce the availability of its DF-3500 series dry-film negative photoresists for wafer level sealing of through-silicon vias. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

EMS introduces 5 μm thick dry film negative photoresist DF-3505 for metallization processes

Industry News | 2018-09-27 17:08:37.0

Engineered Material Systems, is pleased to introduce the availability of its DF-3505 series dry-film negative photoresists for wafer level metallization processes. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

PDR to Launch New IR-E6S Evolution at APEX

Industry News | 2019-01-05 08:00:24.0

PDR today announced plans to exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center. The company will introduce the PDR IR-E6S Evolution in Booth #1519. The new IR-E6S with Auto Lift will be available in February 2019.

PDR-America

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