Industry News | 2012-05-04 09:21:15.0
As printed boards evolve and chip speeds increase, the use of microwave technology in commercial applications, such as cell phone towers and in military products, is expanding.
Industry News | 2018-10-18 10:23:07.0
Typical RoHS Issues in PCB Assembly
Industry News | 2018-12-08 03:29:29.0
SMT Dictionary – Surface Mount Technology Acronym and Abbreviation
Industry News | 2018-10-18 09:37:27.0
How To Set Profile In SMT Reflow Oven
Industry News | 2014-04-08 13:08:59.0
IMS announced today that the A-0402WA attenuator is now available taped face-down in the pocket. The part number for this orientation is IMS2652. This taping arrangement has previously been available for the A-0603 (IMS2533) and A-0805 (IMS1141) sizes. Now all three of the most popular sizes of the A-Series are available in both face up and face down arrangements.
Industry News | 2012-05-15 08:57:25.0
Practical Components Inc., a leading supplier of dummy components, has introduced a display case containing a sampling of components.
Industry News | 2003-05-19 09:53:51.0
The USB Series offers problem free solderability characteristics as well as excellent electrical performance
Industry News | 2021-05-11 14:58:49.0
Z1 Foil Technology improves overall environmental performances and long-term stability
Industry News | 2020-12-10 14:12:04.0
High temperature thin film resistors with an operating temperature up to 215 °C, provide high precision, tight TCR, and excellent stability
Industry News | 2009-09-03 13:01:11.0
NASHVILLE — September 2009 — Kyzen, a world leading provider of environmentally responsible precision cleaning products for electronics and high-technology manufacturing operations, announces that Mike Bixenman will hold a presentation titled “Solder Paste Selection Can Improve Cleaning Performance on Highly Dense Medical Electronic Assemblies” at the upcoming Medical Electronics Symposium. The presentation will take place during Session 6, titled “Systems Manufacturing,” chaired by Randy Crutchfield, Product Engineer, Medtronic Microelectronics Center, and will be held on Thursday, September 17, 2009 at Arizona State University in Tempe, AZ.
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