Industry News: saki bf 3d (Page 1 of 7)

Saki Incorporates its 3D AOI and SPI Systems into Fuji America's Smart Factory Line

Industry News | 2016-12-01 19:42:40.0

Saki Corporation has partnered with Fuji America to incorporate its 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems into Fuji's Smart Factory SMT line at its Vernon Hills, IL facility. Saki's inspection and measurement systems will be used to ensure that the printed circuit boards produced at Fuji adhere to the highest standards of quality and reliability.

SAKI America

Saki Exhibits Smart Factory 3D AOI and SPI Systems at IPC APEX

Industry News | 2017-01-11 18:43:28.0

Saki Corporation, an innovator in the field of automated optical inspection equipment, will exhibit its 3D automated optical inspection (AOI) and 3D solder paste inspection (SPI) systems and their Smart Factory and Industry 4.0 capabilities at IPC APEX 2017, San Diego, CA, in booth 2909. Saki's inspection and measurement systems can be used to communicate with equipment in printed circuit board assembly lines to ensure that the PCBs are produced efficiently and adhere to the highest standards of quality and reliability.

SAKI America

Saki Demonstrates New 3rd Generation 3D AOI Inspection Systems at IPC APEX 2016 Booth 1860

Industry News | 2016-03-01 13:33:18.0

SAKI America will demonstrate its 3rd generation 3D automated optical inspection system at IPC APEX 2016, booth 1860. Saki's new 3D AOI, BF-3Di-Z1, accommodates XXL board sizes, offers dual-lane configurations, optional side angle cameras, and increases throughput by 15%. The 3D AOI system provides measurement of components with a height range from 0-20mm, achieving 1-micron height resolution, a false call rate of

SAKI America

Saki Corporation Exhibits 3D AOI and SPI Systems at SMT Hybrid Packaging

Industry News | 2015-04-21 17:10:49.0

Saki Corporation will demonstrate its BF-3Di automated optical inspection and BF-3Si automated solder paste inspection systems at SMT Hybrid Packaging, Nuremberg, Germany, May 5-7 2015, in Stand 7-331.

SAKI America

Saki Debuts 3rd Generation 3D AOI Inspection Systems at NEPCON Japan Booth E17-46

Industry News | 2016-01-11 09:28:35.0

Saki also demonstrates 3D automated X-ray inspection and measurement systems.

SAKI America

Saki to Demonstrate AOI, SPI, and AXI Software and Systems at IPC APEX Booth 1127

Industry News | 2018-02-26 11:10:21.0

Saki Corporation will demonstrate its new 5th generation, 3D Automated Optical Inspection (AOI), 3D Solder Paste Inspection (SPI), and 3D Automated X-ray Inspection (AXI) systems and software at the IPC APEX Expo, February 27-March 1, San Diego, California, Booth 1127. In addition, Saki's 3D AOI system, based on its Quality-Driven Production (QDP) concept for true closed-loop, machine-to-machine communication, will be part of the Fuji SMART Factory Line in booth 3539.

SAKI America

Saki Demonstrates Range of 2D and 3D AOI Systems at NEPCON Korea, Booth X133

Industry News | 2016-04-07 16:45:47.0

Saki Corporation will demonstrate 2D and 3D automated optical inspection (AOI) systems at NEPCON Korea 2016, COEX, Seoul, Korea, from April 6-8 at booth X133. Technical experts will help assess the correct AOI solution for specific inspection and measurement needs.

SAKI America

Saki Presents 3D AOI Side-Angle Optics and Lighting Technology at NEPCON Thailand, Booth 6D11 and 6D12

Industry News | 2016-06-19 20:07:24.0

Saki Corporation will present its 3D automated optical inspection (AOI) equipment with innovative side-angle cameras and ring lighting technology at NEPCON Thailand 2016, held June 22-25, 2016, at BITEC in Bangkok, Thailand. Saki's 2D AOI system for simultaneous double-sided PCB inspection will also be on display.

SAKI America

Saki Demonstrates XL 3D AOI System and On-the-Fly Debugging Software at SMTA International Booth 726

Industry News | 2016-09-22 18:12:16.0

Saki Corporation will demonstrate its BF-3Di-Z1 3D AOI system for extra-large (686x870mm) PCBs and easy-to-program real-time software in booth 726 at SMTA International, September 27 and 28th, 2016, being held at the Donald Stephens Convention Center, Rosemont, IL. Saki's 3D AOI systems measure heights from 0-20mm with 1µm resolution, measure the surface of surface mount devices and through-hole packages from all four directions without a dead angle or shadowing, and achieve full automation with very low false calls and zero escapes.

SAKI America

Saki Demonstrates Advanced 3D AOI Capabilities at NEPCON China in Booth 1J25

Industry News | 2017-04-13 17:29:30.0

Saki Corporation will demonstrate the advanced capabilities and new extra component detection (ECD) feature of its BF-3Di 3D automated optical inspection (AOI) systems at NEPCON China on April 25-27, 2017 at the Shanghai World EXPO Exhibition & Convention Center in Shanghai, China, in booth 1J25.

SAKI America

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