Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2012-11-07 11:01:55.0
IPC and SMTA jointly announce the agenda for Session 6 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.
Industry News | 2010-11-18 11:06:21.0
Count On Tools introduces Manncorp Selective Solder Nozzles for the IS-450 range of selective soldering machines.
Industry News | 2021-03-12 05:01:11.0
IPC today unveiled a new Thought Leaders Programin which industry experts will assist IPCon key industry issues and offer valuable insights to IPC members and key external stakeholders.
Industry News | 2011-03-01 15:35:42.0
Count On Tools Inc. now manufactures RPS Automation Selective Solder Risers for the Opus range of selective soldering machines.
Industry News | 2016-03-09 16:11:24.0
Presenting "A Review of Jetting Technologies for Fluid Dispensing: Identifying the Features that Influence Productivity" on March 17, 2016, at 10:30 AM.
Industry News | 2012-01-10 19:20:12.0
IPC announced the winning research papers selected in the 2012 IPC International Academic Paper Competition.
Industry News | 2021-04-29 17:19:42.0
ASYMTEK Forte™ MAX offers dual jetting with real-time skew correction for faster, enhanced, automated fluid dispensing
Industry News | 2015-05-29 14:56:22.0
Nordson ASYMTEK earned two prestigious awards for innovative technology during NEPCON China 2015: the Innovation Award from Electronics Manufacturing (EM) Asia and the VISION Award from SMT China magazine. The awards were presented for achievement in product excellence in the dispensing equipment category for Nordson ASYMTEK's Quantum® automated fluid dispensing system. Nordson ASYMTEK products have received these awards for nine straight years.
Industry News | 2018-03-22 21:11:24.0
Nordson ASYMTEK introduces the new Helios™ SD-960 Series Automated Dispensing System for medium and bulk volume deposits of single- (1K) and two-component (2K) materials in electronics manufacturing and printed circuit board assembly. The Helios system is ideal to deposit volumes greater than 1cc, and line widths and dots that exceed 1mm, but it can deposit volumes down to 0.3cc and line widths as narrow as 0.3mm. The system supports highly abrasive thermal interface materials (TIM), silicones, epoxies, and grease for applications such as potting, sealing, gasketing, and structural adhesives.
