Industry News: semiconductor test (Page 16 of 150)

Post-Assembly Test for PCBs - Multitest expands test capacities for fully assembled load boards

Industry News | 2011-09-07 18:25:57.0

Multitest, a designer and manufacturer of final test handlers, contactors and load boards used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, has expanded its post-assembly, flying probe test capacity to meet the growing demands of PCB assembly.

Multitest Elektronische Systeme GmbH

MEMS Test and Calibration: Multitest ships first InPhone system for high parallel microphone test

Industry News | 2011-09-19 15:26:14.0

Multitest has shipped the first InPhone system to a European site of a major IDM.

Multitest Elektronische Systeme GmbH

Flexible licensing gives global access to ASSET's MicroMaster JTAG functional test system

Industry News | 2008-09-12 04:19:45.0

Richardson, TX (September 9, 2008) – With its new licensing arrangement, the capabilities of ASSET� InterTech's MicroMaster e-JTAG CPU emulation functional test and debug system can be flexibly deployed by global enterprises so that engineers have access to the system's capabilities anywhere and at any time. Moreover, MicroMaster can now be flexibly configured with the capabilities required at critical phases in a product's life cycle, beginning with development, moving into manufacturing and culminating in field service and repair.

ASSET InterTech, Inc.

Innovative Sensors Require Advanced Test Equipment Multitest ships first MEMS tri-temp solution for 3+2 axis magnetic test and calibration

Industry News | 2013-11-25 12:14:49.0

Multitest announces that its leading solution for 3-axis magnetometer plus 2-axis low g-test and calibration fully supports the technical features of today’s advanced 3D hall sensors.

Multitest Elektronische Systeme GmbH

Multitest’s Solution for 3D Packages Released to Production Electrical test during the assembly process ensures best production yield

Industry News | 2012-07-09 08:11:26.0

Multitest announces that the first Multitest Plug & Yield solution for the test of 3D packages recently has been released to the customer’s production.

Multitest Elektronische Systeme GmbH

Nordson ELECTRONICS SOLUTIONS to showcase equipment for test and inspection, fluid dispensing, and plasma treatment at SEMICON China 2020

Industry News | 2020-06-18 14:17:04.0

Nordson Corporation (NASDAQ: NDSN) announces that six product lines from its Nordson ELECTRONICS SOLUTIONS division will be exhibiting together at SEMICON China, the world's most well-known semiconductor industry exchange and trading platform, to be held June 27-29, 2020 at the Shanghai New International Expo Center and Shanghai Kerry Hotel Pudong, in booth E3451.

Nordson Corporation

ASSET� InterTech acquires International Test Technologies -- Acquisition will merge structural JTAG test and functional processor emulation testing.

Industry News | 2007-12-05 23:36:32.0

Richardson, TX (December 4, 2007) – ASSET InterTech Inc., (www.asset-intertech.com) has acquired International Test Technologies (ITT -- www.intertesttech.com) of County Donegal, Ireland, a supplier of processor emulation technology used by electronics manufacturers.

ASSET InterTech, Inc.

ASSET is first to support Intel’s new Nehalem micro-architecture and Tolapai SOC with CPU emulation test and diagnostics

Industry News | 2008-06-19 11:24:03.0

MicroMaster gives circuit board designers and manufacturing engineers functional test and diagnostic capabilities

ASSET InterTech, Inc.

Nordson DAGE Announces Further Orders for Its Unique Patented Hot Pin Pull Test Method on the 4000Plus Bondtester The only system that fully complies with IPC-9708 test standards

Industry News | 2014-11-18 18:10:25.0

Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.

Nordson DAGE

ECT Successfully Exhibited at Annual TUG Conference Vendor Fair

Industry News | 2008-05-23 16:57:31.0

Pomona, CA - May 2008 - Everett Charles Technologies (ECT) Semiconductor Test Group (STG) recently attended the 25th annual Teradyne Users Group (TUG) Conference Vendor Fair 2008.

Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)


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