Industry News | 2022-03-17 07:33:24.0
How will a spacecraft harness connect every electrical device on the Europa Clipper, a Jupiter-orbiting spacecraft that will study Jupiter's icy moon Europa? Jacklyn Perry, harness engineer at Johns Hopkins University Applied Physics Laboratory (JHU APL), will provide the answer when she delivers the keynote address, "Harnessing Europa," at the Electrical Wire Processing Technology Expo (EWPTE), on May 11.
Industry News | 2003-04-10 10:27:46.0
IPC and JEDEC Send Out Call for Papers
Industry News | 2010-04-27 09:28:47.0
BANNOCKBURN, Ill., USA — As U.S. companies in the electronics interconnect industry roll up their sleeves to get down to business at IPC’s Capitol Hill Day, two Washington insiders will be sharing their insights on influencing public policy. IPC’s Capitol Hill Day on June 9–10, 2010, will feature Charles “Charlie” Black, Jr. and U.S. Rep. Maurice Hinchey of New York as the keynote and luncheon speakers respectively. The event will focus on influencing legislators on issues critical to the global competitiveness of the electronic interconnect industry.
Industry News | 2010-05-03 20:04:18.0
GAINESVILLE, GA ― Count On Toos Inc., a leading provider of precision components and SMT spare parts, introducing its new MYDATA Midas replacement nozzles and consumables.
Industry News | 2010-07-12 15:41:25.0
The safe and proper control of electrostatic discharge (ESD) is one of the most critical challenges facing the electronics industry today. To address this vital concern, IPC — Association Connecting Electronics Industries® and the Electrostatic Discharge Association (ESDA) released a new ESD training video, DVD-74C, ESD Control for Electronics Assembly.
Industry News | 2010-09-13 15:36:15.0
IPC — Association Connecting Electronics Industries® has released IPC-1601, Printed Board Handling and Storage Guidelines. The industry's sole standard on the handling, packaging and storage of printed boards, IPC-1601 provides users with guidance on how to protect printed boards from contamination, physical damage, solderability degradation, electrostatic discharge and moisture uptake.
Industry News | 2010-12-17 01:47:04.0
IPC has released the A revision of IPC-2222, Sectional Design Standard for Rigid Organic Printed Boards. Helping developers avoid common missteps that reduce board manufacturability, IPC-2222 has been expanded to include more information on board materials, such as relative costs, tolerances of board thickness, unsupported holes, and hole aspect ratios.
Industry News | 2011-01-22 00:14:56.0
IPC has released IPC-1071, Best Industry Practices for Intellectual Property Protection in Printed Board Manufacturing, to assist printed board manufacturers in the development of requirements for the protection of intellectual property (IP) for their customers in commercial, industrial, military and other high reliability markets.
Industry News | 2011-03-09 21:48:03.0
A long-time and active proponent of permanent research and development (R&D) tax credit legislation, IPC — Association Connecting Electronics Industries® applauds the introduction of H.R. 942, "The American Research and Competitiveness Act of 2011," a bipartisan bill to strengthen and make permanent the R&D tax credit. R&D is vital for U.S. electronics companies to be globally competitive and retain U.S. jobs.
Industry News | 2011-05-03 22:50:52.0
Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.
