Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-09-02 03:22:09.0
We present the market leading Condor Sigma W12, equipped with a rotating 13500W 518x513mm heater stage that can uniformly warm up your sample to temperatures up to 175°C. The system is designed for die shear testing on large rectangular glass carriers and 12 inch round carriers, to test glued or solder interconnections on a coating.
Industry News | 2015-08-27 09:41:13.0
Seika Machinery will exhibit in Booth #707 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Seika team will be available to demonstrate the following equipment: DEN-ON INSTRUMENTS CO., LTD. RD-500V Rework Station, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM SPS Solder Paste Mixer and MALCOM Spiral Viscometer.
Industry News | 2015-08-27 13:31:06.0
Seika Machinery will exhibit in Booth #707 at SMTA International, scheduled to take place Sep. 29 - 30, 2015 at the Donald Stephens Convention Center in Rosemont, IL. The Seika team will be available to demonstrate the following equipment: DEN-ON INSTRUMENTS CO., LTD. RD-500V Rework Station, UNITECH UC-250M-CV PCB Board Cleaner, MALCOM SPS Solder Paste Mixer and MALCOM Spiral Viscometer.
Industry News | 2016-02-16 18:14:45.0
Seika Machinery will exhibit in Booth #1145 at the 2016 IPC APEX EXPO, scheduled to take place March 15-17, 2016 at the Las Vegas Convention Center. The Seika team will be available to demonstrate industry-leading equipment from Sayaka, Hioki, SAWA, McDry, Eightech, Unitech, Andes, MALCOM and DENON INSTRUMENTS.
Industry News | 2021-10-07 15:38:24.0
Averatek is pleased to announce that it will present a paper during the during the SMTA International Conference Nov. 1-4, 2021 at the Minneapolis Convention Center. Divyakant Kadiwala, Nazarali Merchant, Ph.D., and Benny Lam co-authored "Reliability of Solder Joints on Flexible Aluminum PC Boards."
Industry News | 2016-08-30 16:08:53.0
Seika Machinery will exhibit in Booth #506 at SMTA International, scheduled to take place September 27-28, 2016 at the Donald Stephens Convention Center in Rosemont, IL. Special show floor prices will be offered on the Sawa Handy Cleaner and select McDry products.
Industry News | 2016-12-21 11:15:14.0
Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
Industry News | 2016-12-21 11:15:27.0
Driven by emerging technology and to suit customer special requirements XYZTEC Condor Sigma's comprehensive range of bond tests is always increasing. One of our latest applications made scratch testing of complex coating much easier to achieve and increased throughput by several orders of magnitude.
