Industry News | 2015-03-20 09:51:33.0
THIN WAFER PROCESSING TEMPORARY BONDING ADHESIVE FILM FOR 3D WAFER INTEGRATION
Industry News | 2015-04-02 18:36:37.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Stand B-1F28 at NEPCON China 2015, scheduled to take place April 21-23, 2015 at the Shanghai World EXPO Exhibition & Convention Center. Nordson DAGE’s team of Test and Inspection experts will demonstrate the 4000Plus Bondtester and XD7600NT Diamond FP X-ray inspection system.
Industry News | 2015-04-09 11:23:43.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit its market-leading portfolio of Test and Inspection equipment in Booth No. 7A-131 at SMT/Hybrid/Packaging, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2015-04-21 15:58:48.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), is pleased to announce that it was awarded a 2015 SMT China Vision Award in the category of Inspection & Testing-Functional Testing for its Camera Assist Automatic Bondtesting. The award was presented to the company during an April 21, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China.
Industry News | 2020-11-06 17:27:12.0
The Assembly Division of MacDermid Alpha Electronics Solutions will be presenting the paper, "Power Package Attach by Silver Sintering – Process, Performance & Reliability" at the PCIM Asia Conference 2020 which will take place from November 16-18 in Shanghai, China.
Industry News | 2015-04-22 14:52:28.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), announces that it has been awarded a 2015 EM Asia Innovation Award in the category of Test Instruments for Camera Assist Automatic Bondtesting on the 4000Plus. The award was presented to the company during an April 22, 2015 ceremony at the Shanghai World Expo Exhibition & Convention Center during NEPCON China. This is the fourth award for this application.
Industry News | 2020-12-01 02:54:29.0
MacDermid Alpha Electronics Solutions announces the release of HELIOFAB AG 7921, a high brightness silver electroplating process for leadframe based LED packages.
Industry News | 2015-06-11 16:18:49.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN), will exhibit in Booth #5744 at SEMICON West 2015, scheduled to take place July 14-16, 2015 at the Moscone Center in San Francisco. Nordson DAGE will present the 4800 wafer level Bondtester for the first time in North America.
Industry News | 2021-02-24 11:47:14.0
YINCAE is excited to announce that we have developed SMT 158N series, including a non-flow, low temperature slow cure and high purity liquid epoxy underfill and capillary underfill encapsulant.
Industry News | 2018-08-13 20:43:08.0
PVA will exhibit at The Battery Show, scheduled to take place Sept. 11-13, 2018 at the Suburban Collection Showplace in Novi, MI. The company will showcase its PV202K-TCM Cartridge Metering System and Delta 8 Selective Coating / Dispensing System in Booth #1348 and supply Parker Chromerics with a Delta 6 Selective Coating / Dispensing System and 1GPU Hydraulic Metering Pump in Booth #201.
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