Industry News: shear test (Page 4 of 5)

Heraeus Electronics Hosts ALL2GaN Event Showcasing Advances in High-Efficiency Power Electronics

Industry News | 2024-04-03 07:36:16.0

Heraeus Electronics is proud to announce that it will host an upcoming ALL2GaN event from April 9-10, 2024, at its facilities in Hanau. This event will focus on the groundbreaking developments in high-efficiency power electronics, particularly focusing on the capabilities of GaN chips to revolutionize the industry with higher efficiency, power density, and smaller sizes.

Heraeus

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-28 12:23:26.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

ASM Assembly Systems (DEK)

New Tacky Flux Technology from Henkel Advances POP Processes and has Cameras Seeing Blue

Industry News | 2009-07-30 21:06:08.0

In a breakthrough for emerging package-on-package (POP) device processes, Henkel has developed Multicore® TFN700B™, a new no-clean, halide-free tacky flux material formulated specifically for today’s challenging POP applications.

Henkel Electronic Materials

NPL 2017 Free Webinars are Launched and Chaired by Bob Willis

Industry News | 2016-12-12 05:28:06.0

The following webinars are available free online throughout 2017 and are organised by Bob Willis for NPL. A direct link is provided for each event to allow you to book online

ASKbobwillis.com

AI Technology (AIT) Introduces Novel High Temperature Large Area Underfill with Proven Stress Absorption

Industry News | 2014-07-28 13:56:52.0

240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.

AI Technology, Inc. (AIT)

TopLine’s Micro-coil Springs (MSC) for CCGAs in Harsh Environments Featured at IPC/APEX EXPO 2017

Industry News | 2017-01-29 09:37:08.0

TopLine will exhibit its MSC Series of Micro-coil springs, a novel interconnect for CCGA (Ceramic Column Grid Array) IC packages for harsh environments. In tests using daisy chain test vehicles, Micro-coil springs absorbed extreme shock of up to 50,000g before failing. Commercial applications include aerospace, avionics, military, down-hole oilfield drilling and automotive electronics. Test results were initially presented at IEEE CPMT 2012.

Speedline Technologies, Inc.

New Yorker Electronics to distribute Gowanda Ceramic Wirewound Chip Inductor Series

Industry News | 2021-05-21 14:09:53.0

Gowanda's Space/Aero Chip Inductors provide Lower Power Consumption in High Frequency Applications

New Yorker Electronics

Ball Grid Array Inspection

Industry News | 2018-10-18 09:58:15.0

Ball Grid Array Inspection

Flason Electronic Co.,limited

Indium Corporation’s Technology Experts to Present at SMTAi 2014.

Industry News | 2014-08-14 21:44:44.0

Several Indium Corporation experts will share their technical knowledge with attendees at the Surface Mount Technology Association's International Conference and Exhibition (SMTAi) from Sept. 28-Oct. 2 in Rosemont, Ill.

Indium Corporation

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Industry News | 2018-12-08 03:29:29.0

SMT Dictionary – Surface Mount Technology Acronym and Abbreviation

Flason Electronic Co.,limited

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