Industry News: silicon wafers (Page 1 of 11)

Whizz Systems, Inc. Installs Crest Ultrasonics' Powersonic™

Industry News | 2021-06-26 09:04:13.0

Whizz Systems, Inc. today announced the addition of a Powersonic™ Benchtop Ultrasonic Cleaner from Crest Ultrasonics.

Whizz Systems

ISVI Showcases High-Speed, High-Resolution Industrial Cameras at The Boston Vision Show

Industry News | 2014-04-15 08:53:30.0

— ISVI Corporation will exhibit at The Vision Show, scheduled to take place April 15-17, 2014 at the Hynes Convention Center in Boston, MA.

ISVI - Industrial Sensor Vision International Corporation

Wafer-Level Packaging Symposium (WLPS) Program Announced and Registration Now Open

Industry News | 2022-12-26 11:44:31.0

The SMTA has announced the accepted speakers for the Wafer-Level Packaging Symposium (WLPS). The symposium will be held February 14-16, 2023 at the Marriott Fremont Silicon Valley in Fremont, California.

Surface Mount Technology Association (SMTA)

‘Origins of Silicon Valley’ Is Keynote Topic of International Wafer-Level Packaging Conference (IWLPC)

Industry News | 2013-06-20 19:16:54.0

SMTA and Chip Scale Review magazine are pleased to announce the keynote presentation for the 10th Anniversary of the International Wafer-Level Packaging Conference, November 5-7, 2013 in San Jose, CA.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Workshops

Industry News | 2016-08-23 16:25:55.0

The SMTA and Chip Scale Review magazine are pleased to announce the Workshops for the 13th Annual International Wafer-Level Packaging Conference (IWLPC). On Thursday, October 20, there will be professional workshops given by instructors who are pre-eminent authorities in their fields. IWLPC will be held October 18-20, 2016 at the DoubleTree Airport Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

Wafer-Level Packaging Symposium Announced

Industry News | 2021-08-13 12:11:05.0

The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is "Advanced Packaging: The Dawn of a New Era." The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2012-08-02 11:47:58.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 9th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Program Finalized and Registration Now Open

Industry News | 2011-07-20 14:49:09.0

The SMTA and Chip Scale Review magazine are pleased to announce the presentation line-up for the 8th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 3-6, 2011 at the Santa Clara Marriott Hotel in Santa Clara, California

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Offers In-Depth Tutorials

Industry News | 2011-08-15 12:43:52.0

The SMTA and Chip Scale Review magazine are pleased to announce eight in-depth tutorials will be offered at IWLPC 2011. Tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems.

Surface Mount Technology Association (SMTA)

Fifth International Wafer-Level Packaging Conference Set for Oct. 13-16

Industry News | 2008-01-07 14:27:27.0

Expands to Four-Day Event with Workshops, Presentations and Exhibits

Surface Mount Technology Association (SMTA)

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