Industry News | 2024-09-16 19:59:33.0
The increasing complexity of integrated systems demands a holistic approach to design, materials, assembly, reliability, and metrology across all levels of integration, from chip to package to board. IPC's Technology Solutions group addresses these challenges and suggests a comprehensive roadmap in their new white paper, "Advanced Packaging to Board Level Integration--Needs and Challenges."
Industry News | 2001-03-20 05:34:19.0
Precision PCB Services announced today that they are now providing BGA Component Rework Training. This course is designed for students that require hands-on skill and knowledge to reliably remove and install many types of the most complex BGA components.
Industry News | 2003-03-21 08:36:51.0
Industry leaders will discuss the current state of the industry, technology innovation, R&D funding issues, OEM requirements, small business concerns, and global business strategies.
Industry News | 2010-08-11 15:24:17.0
Hands-On Skills Training will focus on those seeking new employment skills, and skills for job advancement.
Industry News | 2010-11-04 22:57:30.0
The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.
Industry News | 2010-12-01 13:54:27.0
The SMTA is pleased to announce plans are now finalized for the 2011 Pan Pac Symposium and Tabletop Exhibition.
Industry News | 2011-08-15 12:43:52.0
The SMTA and Chip Scale Review magazine are pleased to announce eight in-depth tutorials will be offered at IWLPC 2011. Tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems.
Industry News | 2014-04-15 08:53:30.0
— ISVI Corporation will exhibit at The Vision Show, scheduled to take place April 15-17, 2014 at the Hynes Convention Center in Boston, MA.
Industry News | 2014-08-04 16:04:28.0
Mark Capizzi appointed as Equipment Marketing and Support Manager
Industry News | 2021-08-13 12:11:05.0
The Wafer-Level Packaging Symposium is scheduled for February 15-17, 2022 in San Jose, CA, USA. The theme of the event is "Advanced Packaging: The Dawn of a New Era." The development of Advanced Package Technology is undergoing a massive change because Electrical System Architects are directly driving package performance requirements.
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