Industry News: silver immersion dewetting (Page 2 of 4)

PCB Sideplating

Industry News | 2019-11-05 22:22:32.0

1. The definition of Sideplating Sideplating is actually the metalization of the board edge in PCB filed. Edge plating、Border plated、plated contour、side metal, these words can be used too to describe same function. 2. Sideplating Process Drilling - Milling plated Slots - Cleaning - Copper sink 3. Pictures to show the finished board’s sideplating

Headpcb

Kyzen Corp. to Exhibit METALNOX M6440 at Omtec 2008

Industry News | 2008-06-06 19:09:39.0

NASHVILLE � June 4, 2008 � Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it will showcase METALNOX M6440 aqueous immersion cleaner and brightener in booth 633 at the 2008 Orthopaedic Manufacturing & Technology (Omtec) exposition and conference scheduled to take place June 18-19, 2008 at the Donald E. Stephens Convention Center in Rosemont, IL.

KYZEN Corporation

Super PCB Offers High-Quality Surface Finishes

Industry News | 2018-11-27 14:03:14.0

Super PCB is pleased to announce that it offers a variety of quality PCB surface finishes. PCB surface finish is the coating between the PCB and components that provides a solderable surface for components and protects the exposed copper circuitry.

Super PCB

What's happening at Nihon Superior in 2008?

Industry News | 2008-03-25 23:59:52.0

Comment from Tetsuro Nishimura, North American Sales Manager

Nihon Superior Co., Ltd.

Dow Electronic Materials to Showcase Leading Materials for Printed Circuit Board Manufacturing at the IPC APEX EXPO

Industry News | 2011-04-06 13:13:52.0

Dow Electronic Materials will showcase its innovative materials for printed circuit boards (PCBs) at this year’s IPC APEX EXPO. Dow will feature a number of its latest products that are tailored to meet the requirements of increasingly complex circuit boards while delivering ever-higher reliability and consistency. Dow’s next-generation of high quality, cost-effective technologies allow customers to meet future market requirements.

Dow Electronic Materials

FCT Assembly Premiers WS159 Tin-Lead Water-Soluble Solder Paste

Industry News | 2009-05-18 17:19:51.0

GREELEY, CO - FCT Assembly debuts WS159 water-soluble solder paste, featuring FCT's latest technology in print and reflow of paste in the water soluble category.

FCT ASSEMBLY, INC.

FCT Assembly Introduces WS177 Lead-Free, Water-Soluble Solder Paste

Industry News | 2009-05-20 19:17:30.0

GREELEY, CO �FCT Assembly introduces WS177 lead-free water-soluble solder paste featuring its latest technology in print and reflow of paste in the water-soluble category for lead-free alloys.

FCT ASSEMBLY, INC.

Kyzen Corp. to Highlight Advanced Cleaning Solutions at MD&M East 2008

Industry News | 2008-05-30 14:53:00.0

NASHVILLE � May 30, 2008 � Kyzen Corporation, a world leading provider of environmentally responsible precision cleaning products for the electronics and high-technology manufacturing operations, announces that it will display AQUANOX A4625 Aqueous Cleaner for Lead-Free Flux Residues and METALNOX M6440 aqueous immersion cleaner and brightener in booth 3030 at the Medical Design & Manufacturing (MD&M) East 2008 exhibition and conference, scheduled to take place June 3-5, 2008 at the Jacob K. Javits Convention Center in New York.

KYZEN Corporation

Bonding Flip Chips on to Flexible Circuit Boards

Industry News | 2011-01-18 13:46:21.0

Time and again, a major challenge lies in attaching integrated circuits (ICs) to highly integrated circuit board substrates in a space-saving manner. Würth Elektronik took this challenge on and found an ideal solution with the ESC (encapsulated solder connection) process. The chips are soldered and at the same time glued 'face-down" in their exact position.

Würth Elektronik GmbH & Co. KG

SN100C Provides Faster Wetting and Increased Spreadability Over SAC305 – Visit Booth #1G08 at NEPCON South China

Industry News | 2017-08-10 17:43:56.0

Nihon Superior Co. announces its Nihon Superior Shanghai subsidiary will exhibit in Booth #1G08 at NEPCON South China, scheduled to take place August 29-31, 2017 at the Shenzhen Convention & Exhibition Center. The reliability of SN100C has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305.

Nihon Superior Co., Ltd.


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