Industry News | 2003-05-22 08:36:27.0
Packaging Saves PCB Board Space Without Sacrificing Power Dissipation Capability
Industry News | 2010-07-08 12:45:56.0
Working together to address the latest round of proposed substance restrictions, IPC and the Indian Printed Circuits Association (IPCA) have submitted comments in response to the Indian Government’s Ministry of Environment and Forests draft notification of E-waste (Management and Handling) Rules 2010.
Industry News | 2010-05-26 14:03:13.0
GAINESVILLE, GA ― May 2010 ― Count On Tools Inc., a leading provider of precision components and SMT spare parts, introduces PB Swiss Tools’ KeyDisc Holder.
Industry News | 2011-02-24 21:39:40.0
The assembly of solar panels is very similar to the assembly of printed boards, making solar power a hot opportunity for electronics assemblers. A small but growing market, solar module production is projected to increase 273% from 2010 to 2014, according to iSuppli. Shedding some light on the rapidly advancing business of solar panel assembly, IPC will host the Solar Assembly and Solar Living Pavilion on the show floor at IPC APEX EXPO, April 12–14, 2011, in Las Vegas.
Industry News | 2010-03-17 18:22:21.0
BANNOCKBURN, Ill., USA, March 16, 2010 — The IPC Intellectual Property Committee will release its first draft of a standard for the protection of intellectual property (IP) designed into printed circuit boards at an open meeting, Tuesday, April 6, 2010, at IPC APEX EXPO® in Las Vegas.
Industry News | 2010-10-30 02:09:14.0
The premiere of Electronics Midwest, a joint production of IPC – Association Connecting Electronics Industries® and UBM Canon, was a confirmed win-win-win success for exhibitors, attendees and organizations alike.
Industry News | 2010-08-09 12:41:05.0
Multitest’s Business Unit Manager Günther Jeserer held a successful Docking and Mounting Interface Workgroup meeting at the recent SEMICON West exhibition on Wednesday, July 14, 2010.
Industry News | 2010-02-12 09:54:05.0
Rosenheim, Germany — February 2010 — Multitest, a designer and manufacturer of final test handlers and final test sockets used by integrated device manufacturers (IDMs) and final test subcontractors worldwide, announces that Ryan Satrom and Valts Treibergs will present a paper titled “An Improved Characterization Technique for Contactors” at the upcoming Burn-in & Test Socket Workshop, schedule to take place March 7-10, 2010 at the Hilton Phoenix East/ Mesa Hotel in Mesa, Ariz. The presentation will be held during Session 4, which will take place Tuesday March 9, 2010 at 10:30 a.m.
Industry News | 2010-03-22 14:33:44.0
Pomona, CA, March 2010 — Everett Charles Technologies (ECT) Contact Products Group (CPG) will feature the latest electrical test technologies in booth 1283 at the upcoming IPC/APEX conference and exhibition, scheduled to take place April 6-8, 2010 at the Mandalay Bay Resort & Convention Center in Las Vegas.
Everett Charles Technologies (acquired by LTX-Credence, which was acquired by Cohu)
Industry News | 2010-09-29 01:30:07.0
FCT Assembly to highlight its leading solder pastes and stencil technologies in booth 226 at the upcoming SMTA International, scheduled to take place October 26-27, 2010 at the Walt Disney World Swan and Dolphin Resort in Orlando, FL.
