Industry News | 2013-03-19 13:24:40.0
Perfect inspection results with combined 2D/3D technology
Industry News | 2014-02-17 20:17:14.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, and SPI Inspection Systems at IPC APEX 2014 booth #2263.
Industry News | 2015-04-07 11:25:45.0
MIRTEC will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7A-504, at the SMT/Hybrid/Packaging 2015 exhibition, scheduled to take place May 5-7, 2015 at the Messe in Nuremberg, Germany.
Industry News | 2014-04-22 14:31:18.0
MIRTEC announces that it will highlight its award-winning 2D/3D In-Line AOI Series configured with MIRTEC’s exclusive OMNI-VISION® 3D Inspection Technology in its distributor pb tec solutions’ booth, # 7-504, at the SMT/Hybrid/Packaging 2014 exhibition, scheduled to take place May 6-8, 2014 in Nuremberg, Germany.
Industry News | 2012-01-23 00:02:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI, X-ray and LED inspection systems at the IPC APEX Expo in booth #3637.
Industry News | 2015-01-21 21:05:20.0
MIRTEC, “The Global Leader in Inspection Technology,” will premier its complete line of 3D AOI and SPI Inspection Systems in Booth #2333 at the 2015 IPC APEX EXPO. The premier technical conference and exhibition for the electronics manufacturing industry will take place Feb. 24–26, 2015 at the San Diego Convention Center.
Industry News | 2013-01-16 11:21:12.0
MIRTEC, “The Global Leader in Inspection Technology”, will premier its complete line of 3D AOI, SPI and LED Inspection Systems at IPC APEX 2013
Industry News | 2013-05-22 11:40:13.0
With its brand-new SIPLACE Di-Series the SIPLACE team of ASM Assembly Systems now offers proven placement quality and maximum process reliability in combination with innovative software also in the low-price segment. Technological details which are rare in this segment, such as digital vision systems, single and dual conveyors and modern, multi-language station software, are standard features on the SIPLACE Di-Series. Available in versions with one, two and four gantries, the SIPLACE D1i, SIPLACE D2i and SIPLACE D4i guarantee quick and smart new product introductions as well as fast and accurate placement capabilities - down to 01005 components.
Industry News | 2011-03-11 17:19:41.0
With options for long boards, heavy boards and thick boards, the SIPLACE Team is already offering a wide range of placement solutions for boards with unusual dimensions. Electronics manufacturers who use the SIPLACE SX1 or SIPLACE SX2 can now extend the range even further: With the SIPLACE Long Board 910 functionality they are now able for the first time to populate boards that are up to 910 mm (35.8 inches) long in a single, continuous placement process.
Industry News | 2009-03-10 00:30:31.0
Siemens Electronics Assembly Systems will introduce the Siplace X-Series powered by the new Siplace CPP MultiStar placement head at APEX 2009 in Booth #1458. The new Siplace X-Series powered by Siplace MultiStar delivers the ideal combination of chip shooting speed along with extensive component range capability required for flexible end of line placement. This �all-in-one� solution, called Collect & Pick & Place (CPP) enables electronics manufacturers to simplify line setup and programming, eliminate the need for line reconfiguration or head changes, and ensures optimal line balancing for higher productivity and lower operational costs.
Industrial Sensor Vision International specializes in advanced camera technology of high resolution fast speed cameras for automation, AOI, 2-D/3-D, SPI inspection and wafer inspection.
3 Morse Road 2A
Oxford, CT USA
Phone: +1 203 592 8723
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