Industry News | 2003-03-12 09:10:10.0
As part of the opening celebration, Teradyne will be exhibiting this week at SEMICON China and in April at Nepcon Shanghai.
Industry News | 2021-05-14 05:35:57.0
MIRTEC announces that it has officially received IPC-2591 (CFX) Certification for its Award-Winning MV-6 OMNI 3D AOI Seriesand MS-11e 3D SPI Series.
Industry News | 2021-06-15 04:22:53.0
IPCs Connected Factory Exchange (CFX) standard defines communication between processes and devices for Industry 4.0. MIRTEC and Optel Software worked together to develop a CFX based interface between MIRTEC's AOI machines and Optel Software's MES system. The goal was to implement full AOI process control at test it at their mutual customer site, VIRTEX plant in Dallas, TX. The resulting CFX interface is vendor independent and will allow MIRTEC to interface with other MES systems, and Optel Software to interface with other AOI machines, with no changes.
Industry News | 2003-02-25 08:18:29.0
Teradyne can now provide deep micro-via technology for customers of high-performance printed circuits.
Industry News | 2003-06-12 08:48:13.0
Richardson Electronics named first worldwide distributor
Industry News | 2023-10-16 12:50:01.0
MIRTEC announces the release of their All-New ART Hybrid 3D AOI System at Productronica 2023. The World's leading trade fair for the electronics manufacturing industry will take place Nov. 14-17, 2023, at the Trade Fair Center Messe München, Germany. All are welcome to MIRTEC's Booth #461 in Hall A2 for a detailed demonstration of what will undoubtedly be recognized as the World's Most Technologically Advanced 3D AOI System!
Industry News | 2023-07-22 03:35:40.0
Discover the power of Access Control Facial Recognition SMT Production Line in Greece. Experience advanced facial recognition technology integrated seamlessly into our state-of-the-art SMT production process. Elevate your security solutions with our innovative and efficient SMT production line, setting new standards in access control systems.
Industry News | 2022-11-05 10:22:02.0
I.C.T Greek customers are doing face recognition systems for access control. Their company has only been in business for a few years. The production equipment they used before was desktop SMT production line equipment. With the increase in orders, they considered the need to upgrade their SMT Production Line.
Industry News | 2022-08-08 07:10:23.0
Registration is now open for the first IPC Advanced Packaging Symposium: Building the IC-Substrate and Package Assembly Ecosystem, to be held October 11-12, 2022, at the Kimpton Hotel Monaco in Washington, D.C. Focusing on the opportunities and challenges for next-generation advanced packaging production, the IPC Advanced Packaging Symposium offers in-depth discussions on strengthening the IC-substrate and package assembly ecosystem across North America and Europe.
Industry News | 2024-06-10 10:03:09.0
Effective May 28, 2024, James Will joined the U.S. Partnership for Assured Electronics (USPAE) as the association's new executive director. USPAE is an IPC subsidiary that focuses on partnership with the U.S. Government to support a more robust defense electronics industrial base. Over its short history, USPAE has steered more than $30 million to industry for high priority projects.
