Industry News | 2010-09-01 21:50:50.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, announces that SN100C wets and spreads faster than SAC305.
Industry News | 2010-03-22 13:14:36.0
GREELEY, CO — FCT Assembly introduces its NL930PT no-clean, lead-free, halide-free pin probable solder paste. The product is unique in that it is a clear residue paste that can print down to low surface area ratios consistently. Combined with SN100C, this solder paste produces the most cosmetically appealing solder joint available on the market.
Industry News | 2010-09-14 17:20:46.0
Nihon Superior Co. Ltd., a supplier of advanced soldering materials to the global market, has released a video demonstrating the results of an evaluation comparing the wettability and spreadability of SN100C and SAC305 solder alloys on stranded wire.
Industry News | 2010-03-22 13:59:02.0
GREELEY, CO — FCT Assembly introduces its NL932 no-clean, lead-free, halide-free solder paste. The paste features excellent solderability, enabling the process to handle the most difficult wetting requirements.
Industry News | 2011-04-20 20:31:30.0
FCT Assembly is pleased to announce that it has been awarded a 2011 NPI Award in the category of Soldering Materials for its NL930PT Pin Probable Solder Paste.
Industry News | 2013-05-07 17:59:59.0
FCT Assembly announces that it will exhibit at the upcoming SMTA Toronto Expo and Tech Forum, scheduled to take place Thursday May 16, 2013 at the Sheraton Toronto Airport Hotel & Conference Centre in Ontario. Keith Howell, Technical Director at Nihon Superior, will hold a technical presentation on nano silver replacement for high lead solders in semiconductor junctions.
Industry News | 2009-03-02 00:10:24.0
TORRANCE, CA � February 2009 � Seika Machinery, Inc., a leading provider of advanced machinery, materials and engineering services, announces that it will verbally represent its complete line of products and technologies at the upcoming SMTA Dallas Expo and Tech Forum, scheduled to take place Tuesday, March 3, 2009 at the Richardson Civic Center in Richardson (Dallas), Texas. Michelle Ogihara, Seika Machinery's Sales and Marketing Manager, will have product brochures available in the booth. Additionally, she will be available to answer questions about the company's products.
Industry News | 2009-07-24 13:38:04.0
To address the thermal requirements posed by smaller outline, higher functioning power semiconductor devices, Henkel has formulated an advanced die attach solder paste suitable for both high-lead and lead-free applications.
Industry News | 2009-11-19 14:48:22.0
Broadening its well-known Multicore die attach solder portfolio, which already includes Multicore DA100 solder paste for high-lead and lead-free applications, Henkel today announced the launch of Multicore DA101. This newest formulation delivers many of the well-known benefits of Multicore DA100, but has been designed for screen print operations, thus offering flexibility for varying process requirements.
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