Industry News | 2013-03-18 09:41:07.0
BTU Europe Ltd.,will highlight solutions to enhance customer value in Booth #7-555 at the upcoming SMT/Hybrid/Packaging exhibition and conference, scheduled to take place 16-18 April 2013 at the Messezentrum in Nuremberg, Germany.
Industry News | 2016-11-14 11:44:29.0
Kester is proud to announce the launch of SF855-LR Soldering Flux, a low solid, low residue, no-clean non-rosin organic flux designed specifically for use in tabber and stringer equipment of Photovoltaic Assembly (PV) through soldering tabs to cell contacts. The extremely low solids content (1.6%) and nature of the activator system results in practically no residue left on the cell after soldering. SF855-LR has a wide operating window and temperature range, and can be used in SnPb, SnAgPb and Pb-free applications.
Industry News | 2018-06-17 16:55:59.0
SHENMAO America, Inc. is pleased to introduce its PQ10 Low Temperature Solder Paste. As the world’s major solder materials provider, SHENMAO produces SMT solder paste, laser soldering paste, cored solder wire, wave solder bar, semiconductor packaging solder spheres, wafer bumping solder paste, flux and solar PV ribbon.
Industry News | 2019-04-15 06:42:26.0
SHENMAO America, Inc. is pleased to announce that it will exhibit at the 2019 IEEE Electronic Components and Technology Conference (ECTC), scheduled to take place May 28-31, 2019 at The Cosmopolitan of Las Vegas. The company will showcase its PQ10 series low temperature solder paste in Booth #500.
Industry News | 2018-07-08 18:45:56.0
SHENMAO America, Inc. today announced plans to exhibit at the SMTA Ohio Expo & Tech Forum, scheduled to take place Thursday, July 12, 2018 at the Embassy Suites Cleveland Rockside. Company representatives will showcase the new PQ10 Low Temperature Solder Paste.
Industry News | 2011-02-03 14:21:01.0
Ironwood Electronics recently introduced a new BGA socket addressing burn-in characterization requirements for BGA devices - CBT-BGA-6011.
Industry News | 2009-09-18 13:59:46.0
Orchid Technologies’ custom high capacity energy storage designs are proven safe and tough.
Industry News | 2019-10-24 16:29:44.0
SHENMAO America, Inc. announces that it was awarded a 2019 Mexico Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Wednesday, Oct. 23, 2019 ceremony that took place during the SMTA Guadalajara Expo & Tech Forum.
Industry News | 2019-11-13 11:33:38.0
SHENMAO America, Inc. announces that it was awarded a 2019 Global Technology Award in the category of Solder Paste for its PF735-PQ10 Low Temperature Solder (LTS). The award was presented to the company during a Tuesday, Nov. 12, 2019 ceremony that took place during productronica in Munich, Germany.
Industry News | 2020-05-30 12:34:54.0
SHENMAO America, Inc. is pleased to introduce its new PF606-RT35 room temperature solder paste (RTS) that has been specially designed for SMT processes. Compared with common pastes, the no-clean paste provides consistent printing performance, low voiding, stable viscosity life, and excellent testability. With the wide reflow window, it even can be easily fit into the process of the most complicated PCB design.