Industry News: solder gold finger (Page 1 of 34)

Three Sun Multilayer PCB Accommodates 0.5mm(�) Holes

Industry News | 2003-05-19 10:06:43.0

The PCB is available with a maximum panel size of 406-by-460mm and a minimum board thickness of 0.8mm.

SMTnet

'T' Series Bi-Metal Cutouts

Industry News | 2003-04-04 07:39:52.0

Designated T11L these have soldered connections for PCB circuits with a grid of 0.2 pitch

SMTnet

Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors

Industry News | 2018-10-18 09:06:41.0

Gold Fingers: A Guide to Understanding Gold-Plated PCB Connectors

Flason Electronic Co.,limited

Precision PCB Services, Inc. Opens New Office in Dallas, Texas

Industry News | 2019-03-14 11:28:14.0

Precision PCB Services, Inc. Opens New Texas Location

Precision PCB Services, Inc

What Design Files Are Necessary for PCB Manufacturing & Assembly?

Industry News | 2018-10-18 11:01:38.0

What Design Files Are Necessary for PCB Manufacturing & Assembly?

Flason Electronic Co.,limited

6 Things to Check Before Submitting Your PCB Design for Manufacturing

Industry News | 2018-10-18 11:23:54.0

6 Things to Check Before Submitting Your PCB Design for Manufacturing

Flason Electronic Co.,limited

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Industry News | 2018-10-18 10:16:53.0

Solder Tinned Pads vs Gold Plated Pads - The Importance of Selecting the Proper Surface Finish

Flason Electronic Co.,limited

Different Techniques for Plating

Industry News | 2018-10-18 11:08:03.0

Different Techniques for Plating

Flason Electronic Co.,limited

Poll Finds Solder Finish, BGA Components and Reflow Soldering Most Challenging for Industry Engineers

Industry News | 2012-01-22 23:16:58.0

More than 350 engineers who attended last week’s IPC webinar, Soldering and Assembly Defects, were polled on their biggest headaches with printed boards, PCB components and PCB assembly process failures. The survey results which identify solder finish, ball grid array (BGA) components and reflow soldering as the greatest challenges, provide webinar co-sponsor, National Physical Laboratory (NPL) of the United Kingdom with useful information as it prepares its NPL Process Defect Clinic for IPC APEX EXPO® 2012.

Association Connecting Electronics Industries (IPC)

IPC TECHNOLOGY TRENDS STUDY REVEALS CHANGES IN STORE FOR PCB FABRICATORS AND SUPPLIERS

Industry News | 2012-04-27 19:20:10.0

PCB Technology Trends 2011, a new study published this week by IPC — Association Connecting Electronics Industries®, shows how the demands of miniaturization and high-speed technology are driving changes in printed circuit board (PCB) processes and materials.

Association Connecting Electronics Industries (IPC)

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