Industry News: solder ground pad (Page 10 of 67)

Metcal customers go for gold with proven solder Technologies

Industry News | 2008-12-02 16:49:28.0

OK International has long been driving productivity for its customers, as a young engineer recently found out when the Metcal MX-500S Soldering and Rework System helped him to gold medal position at the World Skills Competition. OK International has now extended the proven capabilities of this product even further with the launch of the highly anticipated MX-5000 Soldering, Desoldering and Rework System.

OK International

Short introduction of a full automatic solder paste printer's working process | SunzonTech

Industry News | 2020-12-11 20:33:25.0

SunzonTech give fresher a short introduction of a full automatic solder paste printer's working process. It is really benefit for a fresher. Take a look at it!

Shenzhen Sunzon Technology Co.,Ltd.

3-D solder paste inspection with Process Uplink function: More than just defect detection

Industry News | 2012-04-06 19:44:17.0

In SMT electronic assembly production, 3-D SPI has established itself as the additional inspection gate to complement optical or X-ray inspection.

Viscom AG

Why use Via in Pad Design?

Industry News | 2019-11-05 22:08:21.0

Via in pad is the design practice of placing a via in the copper landing pad of a component. Compared to standard PCB via routing, via in pad allows a design to use smaller component pitch sizes and further reduce the PCBs overall size. With component manufactures pushing smaller parts every year and the demand from consumers for smaller devices, the usage of via in pad practices by hardware engineers have become more commonplace. In this article, we will discuss the differences between via in pad and traditional vias, when should you use via in pad, and how to design for it.

Headpcb

Indium10.1 Pb-Free Solder Paste Provides Lowest Voiding Levels for Large Ground Planes

Industry News | 2014-04-30 13:42:31.0

Indium Corporation's Indium10.1 Solder Paste is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation

Barry Industries Introduces Ultra Broadband DC-60GHz Chip Termination for Wireless Backhaul Apps

Industry News | 2016-03-21 13:27:53.0

Barry Industries announces the introduction of an ultra-broadband, DC to 60GHz chip termination for microwave applications. The uniquely designed TV0404FA-50R0JN-91 has been third-party tested to show a typical return loss of 18.5dB or better over a DC to 60GHz bandwidth.

Barry Industries, Inc.

Indium Corporation Features Indium10.1 Pb-Free Solder Paste at SMTAi.

Industry News | 2014-08-05 17:29:07.0

Indium Corporation will feature its new solder paste, Indium10.1, at the SMTAi 2014. Indium10.1 is a Pb-free halogen-containing solder paste with the lowest levels of voiding for QFNs, BGAs, and pads with large ground planes.

Indium Corporation

Pulse Electronics Introduces Monarch Series Multi-mode Satellite Navigation System Ceramic Antenna for GPS, GLONASS, Beidou, and Galileo

Industry News | 2016-01-20 19:07:38.0

Pulse Electronics Corporation's new Monarch Series multi-mode global navigation satellite system ceramic antennas provide wireless signal reception for the four major global and regional satellite systems: GPS, GLONASS, Beidou (Compass), and Galileo. The Monarch Series W3010 is a compact, low profile antenna that delivers high efficiency (75% typical) over a wide bandwidth for enhanced navigation and device tracking. With its profile of 3.2x10x2mm, low weight of 310mg, and VSWR of less than 1.6:1, the Monarch Series fits antenna requirements for items such as portable personal navigation devices, asset tracking equipment, mobile hot spots, mobile point-of-sale terminals, digital walkie-talkies, vehicle data recorders and video systems, public safety devices, telematics equipment, and Internet of Things devices.

Pulse Electronics

Exposed Vias in BGA Pads

Industry News | 2018-10-18 10:26:46.0

Exposed Vias in BGA Pads

Flason Electronic Co.,limited

How to Prevent Short Circuits to Ground in QFN Components?

Industry News | 2018-10-18 08:29:16.0

How to Prevent Short Circuits to Ground in QFN Components?

Flason Electronic Co.,limited


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