Industry News: solder paste exposed to room temperature (Page 4 of 29)

Indium Corporation’s Indium8.9HF Solder Paste Technology Solution to Avoid the Void™

Industry News | 2016-02-11 13:36:43.0

Indium Corporation's Indium8.9HF is a halogen-free, no-clean solder paste that is specifically formulated to Avoid the Void™, while delivering high transfer efficiency with low variability.

Indium Corporation

Practical Components Adds Amkor's FusionQuad� Test and Thermal Cycle Boards to Its Lineup

Industry News | 2008-12-15 15:28:33.0

LOS ALAMITOS, CA - December 2008 - With the wide acceptance of Amkor's FusionQuad� (VQFP/HVF-PQFP), Practical Components has added two new test boards to its lineup. FusionQuad� packages are leadframe-based plastic offering the effective integration of ExposedPad TQFP and MLF� technologies. FusionQuad� not only extends the I/O range of classic leadframe packaging to nearly 400 unique pins, it also delivers an approximate 50 percent reduction in package size for a given leadcount.

Practical Components, Inc.

Nihon Superior Brings Cutting-edge Pastes to the IPC APEX EXPO

Industry News | 2014-02-19 16:03:57.0

Nihon Superior Co. Ltd Nihon Superior will exhibit in Booth #2353 at the IPC APEX EXPO, scheduled to take place March 25-27, 2014 at the Mandalay Bay Resort & Convention Center in Las Vegas, Nevada.

Nihon Superior Co., Ltd.

Nihon Superior to Exhibit the Proven SN100C Alloy at the IPC APEX EXPO

Industry News | 2015-01-19 21:20:27.0

Nihon Superior Co. will exhibit in Booth #739 at the IPC APEX EXPO, scheduled to take place Feb. 24-26, 2015 at the San Diego Convention Center in California. Company representatives will showcase the SN100C P506 D4 lead-free, no-clean solder paste and Alconano Nano-Silver paste.

Nihon Superior Co., Ltd.

Indium Corporation Technology Experts to Present at APEX

Industry News | 2014-02-27 11:48:51.0

Several Indium Corporation technology experts will present at IPC APEX March 25-27 in Las Vegas, Nevada.

Indium Corporation

Indium Corporation to Feature High-Reliability Products at CEIA Wuhan

Industry News | 2021-06-17 15:18:27.0

Indium Corporation will feature proven products from its portfolio of high-reliability solder materials at the CEIA Wuhan Seminar on June 24 in Wuhan, China.

Indium Corporation

Indium Corporation Expert to Present at SEMI-THERM

Industry News | 2022-03-09 12:43:18.0

Indium Corporation's Miloš Lazić, product development specialist, will share his industry knowledge on metal thermal interface materials (TIMs) in high-performance applications at SEMI-THERM, March 21-25, San Jose, Calif., U.S.

Indium Corporation

Indium Corporation Technology Experts to Present at IPC Southeast Asia High Reliability Conference

Industry News | 2014-08-07 11:41:44.0

Indium Corporation's Sze Pei Lim, technical manager - Southeast Asia; and Sehar Samiappan, area technical manager, will present at the IPC Southeast Asia High Reliability Conference on August 20 in Penang, Malaysia.

Indium Corporation

Nihon Superior to Debut a New Solder Paste to Solve New Challenges in the Electronics Industry at SMTA International

Industry News | 2016-08-30 15:31:51.0

Nihon Superior Co. will exhibit in Booth #418 at SMTA International, scheduled to take place September 27-28, 2016 at Donald Stephens Convention Center. The reliability of the company’s SN100C lead-free alloy has been proven in a wide range of electronics assembly products. The eutectic character of the silver-free SN100C alloy and the associated high fluidity provides faster wetting and increased spreadability over SAC305, which is beneficial in wave soldering and hand soldering applications as well as in reflow.

Nihon Superior Co., Ltd.

Kester to Exhibit and Present at SMTA International 2016

Industry News | 2016-09-08 17:26:45.0

Kester will be exhibiting (booth #500) at Surface Mount Technology Association International (SMTAI) 2016, which will take place September 27-28 at the Donald Stephens Convention Center in Rosemont, IL.

Kester


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