Industry News: solder pitch 1.27 (Page 1 of 56)

Cable Jumpers Provide Flexible Connections

Industry News | 2003-05-02 08:01:53.0

Flexstrip cable jumpers provide multiconductor board-to-board connection without wire stripping, cutting to length or solder preparation.

SMTnet

Evaluation Kit for Novel Board-to-board Jumpers

Industry News | 2003-03-04 08:08:23.0

In a move that broadens its interconnect design services, Micromark C and CD has introduced a new development kit for the Flexstrip jumpers flexible interconnect system.

SMTnet

'T' Series Bi-Metal Cutouts

Industry News | 2003-04-04 07:39:52.0

Designated T11L these have soldered connections for PCB circuits with a grid of 0.2 pitch

SMTnet

Card-to-cable Connector Meets QS9002 Standard

Industry News | 2003-02-20 08:04:10.0

The Mini-Fix card-to-cable connector is designed to withstand hundreds of mating cycles with high contact security and mechanical stability.

SMTnet

Investment Boosts SMT Placement and Rework

Industry News | 2003-06-04 09:19:23.0

With increasing demand for fine pitch placements and a growing amount of fast turnaround high-tech low-volume prototype work, Speedboard has invested in additional SMT/BGA placement/rework equipment.

SMTnet

Connectors Handle Up to 54A Safely Onboard

Industry News | 2003-05-19 08:44:19.0

Two new PCB power connectors offer easy high power wiring (up to 54A) with built-in safety features to prevent incorrect connections and resist strong vibration.

SMTnet

Wire-to-board Range Handles Up To 16A

Industry News | 2003-05-12 09:19:51.0

No larger than conventional 12A wire-to-board connectors for PCB applications

SMTnet

Power Connectors Bring Heavy Cables Onboard

Industry News | 2003-05-23 08:24:49.0

Solid cables of up to 35mm2 cross-section now can be connected to PCBs easily, reliably and cost-effectively with the new Power Combicon range of connectors.

SMTnet

What's happening at MIRTEC in 2008?

Industry News | 2008-03-25 23:53:54.0

Comment from Brian D�Amico, President

MIRTEC Corp

MIRTEC to Preview the MP-520 Advanced System in Package (SiP) Inspection and Measurement System at SEMICON West 2015

Industry News | 2015-06-11 16:02:18.0

MIRTEC, "The Global Leader in Inspection Technology," will exhibit its most recent solutions for System in Package (SiP) inspection and measurement at SEMICON WEST 2015; July 14-16, 2015, at the Moscone Center in San Francisco, CA. Visitors are invited to booth # 2343 for a detailed demonstration of this exciting new technology.

MIRTEC Corp

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