Industry News: solder preform (Page 1 of 37)

SMTA Europe's Harsh Environments Conference Session 7 to Focus on Hi-Temp Mats/Fab

Industry News | 2018-04-22 19:12:45.0

SMTA Europe announces Session 7 Technical Program on High Temperature PCB Materials and Fabrication at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

New Tutorial Released With IPC-2223C Provides Expert Advice and Tips for Designers Working With Flexible Circuits

Industry News | 2012-03-28 08:47:23.0

he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.

Association Connecting Electronics Industries (IPC)

Reballing Preforms Now in 3 Days

Industry News | 2013-09-03 11:52:21.0

BEST's EZReball(TM) reballing preforms now are available as standard in 3 business days. Expedited packs are in available in 24 hours to help you with your reballing projects

BEST Inc.

BEST Installs New Laser System for PCB Depaneling, Hole Drilling, Selective Ablation

Industry News | 2015-10-21 17:02:27.0

Product lead time reductions and increased capabilities for EMS providers and board shops

BEST Inc.

SHENMAO Features Solder Preforms at IPC APEX 2016

Industry News | 2016-03-11 00:15:11.0

SHENMAO Solder Preforms offer accurate solder deposition for various soldering processes. Reel packaged Solder Preforms provide opportunity for automation and efficient application to supplement solder when insufficient quantity solder paste is provided by design.

Shenmao Technology Inc.

Indium Corporation Features Gold Alloy Solder Preforms at SPIE Photonics West

Industry News | 2018-12-16 09:10:36.0

Indium Corporation will feature its precision gold alloy solder preforms at the SPIE Photonics West event, February 2-7, in San Francisco, Calif.

Indium Corporation

Indium Corporation Features Gold-Tin Solder Preforms for Precision Die-Attach Applications at AeroDef2016

Industry News | 2016-01-05 14:46:38.0

Indium Corporation will feature precision gold-tin (AuSn) solder preforms for die-attach at AeroDef 2016, Feb. 8-10, in Long Beach, Calif. AuSn preforms are designed for high-reliability applications, such as aerospace, defense, and medical.

Indium Corporation

Solder Preform World – Not New Technology but Very Interesting Option - Bob Willis Charity Webinar

Industry News | 2020-06-02 09:14:56.0

Our webinar is FREE to join but we do ask attendees to consider contributing a small amount to our chosen charities Mind – Better Mental Health https://www.mind.org.uk/donate Marie Curie – Living with Terminal Illness https://www.justgiving.com/mariecurie

ASKbobwillis.com

SHENMAO Launches PF606-PW215 Water-Soluble Solder Paste

Industry News | 2018-07-19 20:30:51.0

SHENMAO America is pleased to introduce the PF606-PW215 water-soluble solder paste. The company offers a full line of water-soluble fluxes and solder pastes for SMT and IC packaging applications. SHENMAO provides halide-containing and halide-free fluxes for tin/lead as well as lead-free solder alloys.

Shenmao Technology Inc.

Indium Corporation to Exhibit at Semicon West

Industry News | 2005-06-16 22:27:05.0

Indium Corporation will be exhibiting their newest products for the Semiconductor and Power Semiconductor assembly industry at Semicon West on July 12-14 at the Moscone Center in San Francisco, CA.

Indium Corporation

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