Industry News | 2007-04-25 19:12:21.0
04/25/2007
Industry News | 2015-10-05 18:14:25.0
Several Indium Corporation experts will share their knowledge and expertise at the IMAPS 48th annual International Symposium on Microelectronics, Oct. 26-29, in Orlando, Fla.
Industry News | 2019-01-16 20:44:36.0
Indium Corporation has acknowledged several of its employees with the annual Silver Quill Award.
Industry News | 2016-02-25 14:29:00.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2016-05-31 20:58:06.0
SHENMAO Features a new Sn-3.0Ag-0.5Cu Lead-Free Solder Paste PF606-P133H for laser soldering applications. Dispensed from syringes, it is developed for automatic laser soldering processes in the packaging and assembly of surface mount devices and microelectronics. Laser energy is applied at the precise location in a non-contact procedure to create high shear strength well-formed solder joints during the lower thermal stress process while reducing intermetallic formation. PF606-P133H solder paste produces minimal flux residue and no-splash or solder balling issues. It is well suited for high yield soldering of sensitive electronic components in manufacturing or repair of electronic devices that can-not tolerate conventional reflow-oven temperature.
Industry News | 2021-08-26 11:17:24.0
Indium Corporation's Leo Hu, senior area technical manager – East China, will share insights on tool-free solder preform technology for power module assembly during a poster session at PCIM Asia, Sept. 9-11, Shenzhen, China.
Industry News | 2019-04-01 19:56:55.0
SHENMAO America, Inc. provides a variety of solder paste products for SMT assembly including Tin Lead Solder Paste, Lead-Free Solder Paste, Water-Soluble Solder Paste, Package-on-Package Solder Paste, Low-Temperature Solder Paste, and Halogen-Free Solder Paste.
Industry News | 2004-09-09 12:55:33.0
Implementing Lead-free Assembly at Your Facility
Industry News | 2004-10-26 14:26:02.0
Indium Corporation of America�s Germanium Chemicals Division has passed its ISO-9001:2000 certification audit.
Industry News | 2004-11-30 17:12:14.0
Indium Corporation of America has appointed Wang Ming as Technical Manager in China.
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