Industry News: solder splash after reflow (Page 14 of 33)

Vitronics Soltec USA to Introduce New YouTube Channel at IPC APEX 2012

Industry News | 2012-02-22 16:08:53.0

Vitronics Soltec USA will introduce its new YouTube channel at their booth (3509) at the IPC APEX 2012 trade show in San Diego, CA. The new channel will initially feature several animations that highlight key features and functions of each of Vitronics Soltec's three soldering machine types: wave, selective, and reflow.

Vitronics Soltec

New Joint Enhanced Solder Paste and Solder Joint Encapsulation Material Flux from SHENMAO

Industry News | 2021-03-02 14:45:26.0

SHENMAO America, Inc. is pleased to introduce its newJoint Enhanced Solder Paste (JEP) PF606-EP305 and Solder Joint Encapsulation Material (SJEM) Flux SMEF-Z52. The new epoxy-based solder materials for very fine pad size (70 μm) soldering, especially for advanced display packaging and assembly.

Shenmao Technology Inc.

Ersa to Demo High-Performance Wave Solder Automation Line at APEX

Industry News | 2020-01-07 11:01:33.0

Kurtz Ersa Inc. today announced plans to exhibit at the 2020 IPC APEX EXPO, scheduled to take place Feb. 4-6, 2020 at the San Diego Convention Center in California. Company representatives will showcase Ersa‘s wave soldering, reflow soldering, selective soldering, rework equipment, I4.0 connectivity and more in Booth #844.

kurtz ersa Corporation

Viscom SPI-AOI Uplink Named Best Product – Europe

Industry News | 2012-10-22 15:54:35.0

Viscom announces that it was awarded a 2012 Global Technology Award in the category of Best Product – Europe for its SPI-AOI Uplink Feature.

Viscom AG

Viscom Scores NPI Award for Its SPI-AOI Uplink Function

Industry News | 2013-03-07 06:42:15.0

Viscom announces that it has been awarded a 2013 NPI Award in the category of Software – Process Control for its SPI-AOI Uplink function.

Martel Marketing Communications, Inc.

EasySpheres Highlights RF741 No-Clean Gel Flux

Industry News | 2009-07-17 18:26:03.0

POWAY, CA — July 2009 — EasySpheres LLC highlights RF741 No-Clean Gel Flux designed for electronic component rework and repair applications.

EasySpheres LLC

Understanding PCB Design & Material Warpage Challenges – Learn More at SMTAI

Industry News | 2016-09-23 15:41:59.0

Akrometrix today announced that Ryan Curry, Technical Account Manager, will co-present a paper with Don Adams, Manufacturing Engineering Manager at Bose Corporation, during SMTA International. The presentation, “Understanding PCB Design and Material Warpage Challenges Which Occur during B2B/Module-Carrier Attachment,” is scheduled to take place during session APT7, “Package and PCB Interactions,” on Wednesday, September 28th at 4 p.m.

Akrometrix

MANNCORP Now a Full-Line Distributor of KIC Thermal Profiling Products

Industry News | 2011-02-04 02:22:32.0

The familiar "KIC On Board" blue diamond logo is expected to appear on a record number of reflow ovens now that Manncorp has been named a Western Hemisphere Distributor for KIC profilers and related products.

Manncorp

Manncorp CR Series Reflect Trend To Smaller & Greener Reflow Ovens

Industry News | 2011-12-31 02:26:01.0

Manncorp CR Series Reflect Trend To Smaller & Greener Reflow Ovens

Manncorp

SHENMAO Debuts Low-Temp Joint Enhanced Solder Paste PF735-EP307

Industry News | 2022-11-15 12:33:16.0

SHENMAO America, Inc is pleased to introduce its newest offering: PF735-EP307 Joint Enhanced Solder Paste (JEP). The new low melting point epoxy-based solder material has been developed for extremely fine-pitch or fine pad soldering, especially advanced display assembly.

Shenmao Technology Inc.


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