Industry News: solder void dfn (Page 1 of 43)

SQC in Electronics Manufacturing

Industry News | 2003-06-10 08:16:44.0

The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.

SMTnet

Webtorial: Design and Assembly Process Challenges for Bottom Terminations Components (BTCs) such as QFN, DFN and MLF in Tin-Lead & Lead Free World

Industry News | 2013-01-02 16:01:34.0

A Convenienient and informative online tutorial about Design and Assembly Process Challenges for Bottom Terminations Components

Surface Mount Technology Association (SMTA)

Stencil aperture considerations for QFN chips

Industry News | 2018-10-18 08:40:47.0

Stencil aperture considerations for QFN chips

Flason Electronic Co.,limited

New Technology for Void-free Reflow Soldering

Industry News | 2018-10-18 09:16:42.0

New Technology for Void-free Reflow Soldering

Flason Electronic Co.,limited

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Industry News | 2018-10-18 08:17:09.0

How to Prevent Solder Joint Voiding and Cold Solder Defects during the SMT Reflow Process

Flason Electronic Co.,limited

Guidelines for Design and Assembly Process Implementation for Bottom Termination Components Released by IPC

Industry News | 2011-05-03 22:50:52.0

Assemblers who have tried to resolve problems that stem from the rapidly growing array of advanced packages are getting some help from IPC with the newly released IPC-7093, Design and Assembly Process Implementation for Bottom Termination Components. This standard describes the critical design, assembly, inspection, repair, and reliability issues associated with bottom termination components (BTCs) whose external connections consist of metallized terminals that are an integral part of the component body.

Association Connecting Electronics Industries (IPC)

IPC RELEASES NEW REVISION OF SURFACE MOUNT DESIGN AND LAND PATTERN STANDARD

Industry News | 2010-07-22 22:37:02.0

IPC — Association Connecting Electronics Industries® has released the B revision of IPC-7351, Generic Requirements for Surface Mount Design and Land Pattern Standard. The leading industry standard for surface mount land pattern design and layout, IPC-7351B provides designers and printed board fabricators with updated guidance on requirements of land pattern geometries used for the surface attachment of electronic components, as well as surface mount design recommendations for achieving the best possible solder joints.

Association Connecting Electronics Industries (IPC)

Session 2 of SMTA Europe's Harsh Environments Conference to Focus on Reliability

Industry News | 2018-04-09 19:51:33.0

SMTA Europe announces Session 2 Technical Program on Reliability of Soldered Alloys at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.

Surface Mount Technology Association (SMTA)

SMT Book – Surface Mount Technology Book PDF

Industry News | 2018-12-08 03:15:55.0

SMT Book – Surface Mount Technology Book PDF

Flason Electronic Co.,limited

SMT Book – Surface Mount Technology Book PDF

Industry News | 2018-12-08 03:17:14.0

SMT Book – Surface Mount Technology Book PDF

Flason Electronic Co.,limited

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