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Saki Demonstrates 3D SPI, AOI, AXI, and 2D Bottom-side AOI at IPC APEX Expo Booth 1407

Industry News | 2019-01-22 12:41:53.0

Saki Corporation will present its 3D solder paste inspection (SPI), automated optical inspection (AOI), and automated x-ray inspection (AXI) systems, plus new 2D Bottom-side AOI, at IPC APEX Expo 2019, January 29-31, at the San Diego Convention Center, San Diego, CA, at booth #1407. In addition, Saki's M2M communication/Industry 4.0/Smart Factory capabilities will be on display in the Fuji booth #1317 and in the Hermes/CFX production line.

Saki Debuts 3rd Generation 3D AOI Inspection Systems at NEPCON Japan Booth E17-46

Industry News | 2016-01-11 09:28:35.0

Saki also demonstrates 3D automated X-ray inspection and measurement systems.

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