Industry News | 2003-04-29 08:27:33.0
Emerson Energy Systems is using Weidmuller's Minimate S2L/B2L PCB connector for its IMT 2000 multifunction unit, thanks to its space saving design and competitive price.
Industry News | 2003-06-10 08:39:25.0
New from Unitek Eapro is a series of desktop systems for hot bar bonding applications.
Industry News | 2003-06-16 09:12:35.0
Boards tout up to 8MGates devices, on-board RAM, banks of I/O, many programmable user interfaces
Industry News | 2003-06-10 08:16:44.0
The following text describes the application of NWA Quality Analyst to quality control in the assembly of electronic components.
Industry News | 2018-10-18 10:43:28.0
Suggested 14 and 16 Layer Board Layouts
Industry News | 2018-10-18 11:09:41.0
Advantages of Design for Manufacturability Rules
Industry News | 2003-09-11 16:50:12.0
The printed circuit board industry is an ever-changing marketplace. The technologies of today certainly aren�t standing still, and neither should today�s PCB designer
Industry News | 2017-08-06 19:39:48.0
The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2018-07-10 20:52:09.0
High density interconnect (HDI) technology makes it possible to place more components on both sides of a raw PCB and from a design perspective, HDI technology requires different setup and thought as to what is needed and how to accomplish it. As a result, designers need to understand the structure of the HDI traces and vias, and what their options and effects are to the cost and electronics involved.
