Industry News: staking material for capacitors (Page 1 of 3)

Nordson ASYMTEK Demonstrates the Helios Dispenser for 1K and 2K Materials for Electronics Manufacturing at Bondexpo 2019

Industry News | 2019-09-13 07:56:55.0

Nordson ASYMTEK announces that it will demonstrate its Helios™ SD-960 Series Automated Fluid Dispensing System at Bondexpo, Stuttgart, Germany, in Hall 6, stand 6425.

ASYMTEK Products | Nordson Electronics Solutions

IPC J-STD-001E Released: Industry Requirements for Soldered Electrical and Electronic Assemblies Updated

Industry News | 2010-04-10 02:07:54.0

IPC has released the E revision of IPC J-STD-001, Requirements for Soldered Electrical and Electronic Assemblies. Recognized worldwide as the sole industry-consensus standard for soldering processes and materials, IPC J-STD-001E encompasses advanced technologies and provides new and updated criteria for all three classes of construction as well as expanded support for lead-free manufacturing.

Association Connecting Electronics Industries (IPC)

Award for New Product Innovation Announced

Industry News | 2016-04-20 10:27:40.0

BEST, Inc. was presented Circuit Assembly’s NPI Award for its HeatShield Gel™ high temperature shielding product at the IPC APEX Expo on Feb. 24 in San Diego, Calif.

BEST Inc.

BEST Developes Revolutionary Gel for Masking of Parts

Industry News | 2016-01-05 16:10:10.0

Novel method for protecting electronic components from heat.

BEST Inc.

Arc-Suppressing RC Networks are Essential Components for Today's Telecommunications Dependency

Industry News | 2020-11-23 16:20:54.0

Electrocube's Standard and Heavy-Duty RC Networks Absorb Spark Discharges and Induced Noise while Managing Surge Voltage/Oscillations

New Yorker Electronics

IDTechEx Predicts New Shapes, Materials and Applications for Supercapacitors

Industry News | 2014-01-16 12:32:20.0

Electrochemical Double Layer Capacitors & Supercabatteries AEDLC: Interviews with users and technology suppliers: Advances Creating Extra Markets - Map to 2025

IDTechEx, Inc.

Engineered Materials Systems Introduces Fast Cure Conductive Adhesive for Small- to Medium-Size Chip Bonding

Industry News | 2016-11-15 18:10:16.0

Engineered Materials Systems today announced its new EMS 561-854 Fast Cure Conductive Adhesive for die-attach applications with small- to medium-size die and tantalum capacitors. EMS 561-854 is designed to cure in one minute at 170ºC.

Engineered Conductive Materials, LLC

PhiChem Joins Underwriters Laboratories (UL®) Standards Technical Panel 796 for Printed Wiring Boards

Industry News | 2015-09-18 15:17:40.0

PhiChem has been accepted as a member of Underwriters Laboratories (UL®) Standards Technical Panel (STP) for Printed Wiring Boards STP796, which covers standards UL746E and UL796. UL746E is the UL Standard for Polymeric Materials – Industrial Laminates, Filament Wound Tubing, Vulcanized Fiber, and Materials Used in Printed-Wiring Board, while UL796 is the Standard for Printed-Wiring Boards.

PhiChem Corporation

Gen3 provides key tools for electric vehicles

Industry News | 2022-03-23 13:20:13.0

UK Manufacturer of test and measurement equipment for the electronics industry, GEN3 is working overtime to produce enough of its systems to meet the rapidly growing demand for both their AutoSIR2+ and AutoCAF2+ Systems.

Gen3 Systems

Gen3 provides key tools for electric vehicles

Industry News | 2022-03-23 13:20:22.0

UK Manufacturer of test and measurement equipment for the electronics industry, GEN3 is working overtime to produce enough of its systems to meet the rapidly growing demand for both their AutoSIR2+ and AutoCAF2+ Systems.

Gen3 Systems

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