Industry News: stencil design for bga (Page 1 of 37)

Long Life for Heatsink Thermal Tape

Industry News | 2003-07-02 08:54:26.0

A novel unreinforced, thermally conductive, pressure sensitive adhesive tape delivers very high bond strength to low-energy surfaces.

SMTnet

Tessera Introduces PYXIS� Packaging Technology - World's First Chip-Scale Packaging Solution for Highly Integrated RF Modules

Industry News | 2003-04-15 08:57:18.0

First Implementation of the Package Platform Delivers 50-percent Cost, 60-percent Height, and 75-percent Area Reductions over Conventional RF Module Technologies

SMTnet

MIRTEC Corp. Wins a 2008 NPI Award for its MV-7L In-Line AOI System

Industry News | 2008-04-07 22:15:22.0

OXFORD, CT � March 31, 2008 � MIRTEC Corp., the AOI market leader in North America, announces that it has been awarded a 2008 NPI Award in the category of Test & Inspection, AOI for its MV-7L In-Line AOI System. The award was presented to the company during a Monday, March 31, 2008 ceremony that took place in the Mandalay Bay Resort & Convention Center in Las Vegas before the start of APEX 2008.

MIRTEC Corp

MIRTEC Receives 2008 Advanced Packaging Award for Their MV-7L In-Line AOI Machine

Industry News | 2008-07-19 15:38:37.0

OXFORD, CT � July 16, 2008 � MIRTEC, the global leader in Automated Optical Inspection Technology, announces that its MV-7L In-Line AOI System was named First Finalist in the category of Inspection Equipment & Services during the Advanced Packaging Award ceremony that took place on Wednesday, July 16, 2008 at the St. Regis Hotel Conservatory during the SEMICON West exhibition in San Francisco.

MIRTEC Corp

SMTAI Call for Papers

Industry News | 2009-03-12 18:25:36.0

The SMTA International Technical Committee invites you to submit an abstract for the 2009 conference. Short course descriptions are also being solicited.

Surface Mount Technology Association (SMTA)

SMTA International Call for Papers

Industry News | 2010-02-17 18:45:59.0

The SMTA International Technical Committee invites you to submit an abstract for the 2010 conference. Short course descriptions are also being solicited.

Surface Mount Technology Association (SMTA)

IPC Issues Call for Participation for IPC APEX EXPO 2020

Industry News | 2019-02-18 17:18:54.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2020 to be held at the San Diego Convention Center. Professional development courses will take place February 2, 3 and 6, 2020 and the technical conference will take place February 4–6, 2020.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for 2014 IPC APEX EXPO

Industry News | 2013-04-03 18:46:12.0

IPC – Association Connecting Electronics Industries® invites researchers, academics, technical experts and industry leaders to submit abstracts for the 2014 IPC APEX EXPO® at the Mandalay Bay Resort and Convention Center in Las Vegas.

Association Connecting Electronics Industries (IPC)

IPC Issues Call for Participation for IPC APEX EXPO 2017

Industry News | 2016-04-29 11:38:38.0

IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC APEX EXPO 2017 to be held at the San Diego Convention Center. Professional development courses will take place February 12, 13 and 16, 2017 and the technical conference will take place February 14–16, 2017.

Association Connecting Electronics Industries (IPC)

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