Industry News: strain gages (Page 1 of 1)

IPC/JEDEC-9704A Takes the Stress Out of Strain Gage Testing

Industry News | 2012-05-23 14:18:26.0

Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing

Association Connecting Electronics Industries (IPC)

How Much Strain Can a Package Take?

Industry News | 2011-12-14 15:35:33.0

Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.

Association Connecting Electronics Industries (IPC)

New Yorker Electronics Releases Expanded VPG C4A Series Stress Analysis Strain Gage Sensors

Industry News | 2021-01-19 13:51:42.0

New Micro-Measurements Advanced Sensors Technology C4A Series Strain Gages Enable Easy, No-Solder Installation

New Yorker Electronics

Seika Machinery to Exhibit in Booth 2813 at SMTA International

Industry News | 2024-09-30 19:35:38.0

Seika Machinery, Inc. today announced plans to exhibit at SMTA International, scheduled to take place Oct. 22-24 at the Donald E. Stephens Convention Center in Rosemont, Illinois. Seika Machinery will be showcasing a range of innovative products at Booth 2813 including the Sayaka CT23S router, Malcom RCX profiler, Malcom Dip-Tester, Sawa ultrasonic SC-500HE portable stencil cleaner, Unitech PCB Cleaner and Kyowa Strain Gage tester.

Seika Machinery, Inc.

STI to Present at 2009 Pan Pacific Microelectronics Symposium & Tabletop Exhibition

Industry News | 2009-01-21 19:48:20.0

MADISON, AL � January 2009 � STI Electronics, Inc., a full service organization providing training, consulting, electronic and industrial product distribution, laboratory analysis, prototyping, and small- to medium-volume PCB assembly, announces that Mark T. McMeen, V.P. of Engineering Services, will present during the 2009 Pan Pacific Microelectronics Symposium and Tabletop Exhibition. The presentation will take place on Wednesday, February 11, 2009 from 9-10 a.m. during Session WA2 on Thermal Studies and is titled, �Strain Gage Testing: The Delta Effect of Thermal Cycle Testing.�

STI Electronics

Seika Machinery Commemorates 25th Anniversary during APEX

Industry News | 2019-01-31 19:51:12.0

Seika Machinery,announces the company’s 25th year in business. The company celebrated the milestone with an appreciation dinner for its employees and representatives during the IPC APEX EXPO.

Seika Machinery, Inc.

Seika Machinery Sees Increased Emphasis on SMT Line Process Improvements

Industry News | 2021-06-09 04:41:58.0

Seika Machinery, Inc. has seen increased popularity and demand of its process control systems.

Seika Machinery, Inc.

Get Ready for SMTAI with Seika Machinery

Industry News | 2021-10-31 05:01:48.0

Seika Machinery, Inc. is excited to announce its participation in multiple committees during the SMTA International Exposition, scheduled to take place Nov. 3-4, 2021 at the Minneapolis Convention Center in Minneapolis, MN. Seika will have leading equipment on display, in addition to participating in the MSD Council Meeting and Women's Leadership Program.

Seika Machinery, Inc.

Military-Grade, Mission-Critical VPG Resistors Released by New Yorker Electronics

Industry News | 2020-11-25 13:12:15.0

VPG Foil Resistors new Model 303337 Ultra-High Precision Military- and Space-Grade Resistor One of the Industry's Most Precise and Stable Precision Resistors

New Yorker Electronics

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