Industry News | 2016-02-27 22:07:08.0
GPD Global will exhibit in Booth#1818 at the upcoming IPC APEX EXPO 2016 Conference and Exhibition. See a live demonstration of 01005 dispensing on the MAX series high precision dispenser, the intuitively programmed Island series benchtop dispenser, and a full range of dispense pumps used on GPD dispense systems.
Industry News | 2020-02-18 14:31:52.0
Join us for High Reliability Forum as a presenter or instructor and share your expertise in electronics with high reliability requirements.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2018-08-29 19:35:22.0
IPC — Association Connecting Electronics Industries® invites engineers, researchers, academics, technical experts and industry leaders to submit abstracts for IPC High Reliability Forum to be held May 14–16, 2019 in Hanover (Baltimore), Md.
Industry News | 2010-06-11 15:59:00.0
BANNOCKBURN, IL — IPC — Association Connecting Electronics Industries® has released the A revision of IPC-9592, Requirements for Power Conversion Devices for the Computer and Telecommunications Industries. First released in 2008, IPC-9592 sets the requirements for power conversion devices (PCDs) in the computer and telecommunications industries, including design for reliability, design qualification testing, manufacturing conformance testing and quality processes.
Industry News | 2020-02-18 14:26:44.0
Deadline extended to February 21, 2020
Industry News | 2011-12-14 15:35:33.0
Manufacturing processes, handling and printed circuit assembly (PCA) test can put a lot of mechanical stresses on packages, causing failures. As grid array packages get larger, identifying how to set safe levels for these steps becomes more difficult. A new quantitative test methodology within IPC/JEDEC-9707, Spherical Bend Test Method for Characterization of Board Level Interconnects, lets users determine how much strain packages can take before reliability degradation.
Industry News | 2012-05-23 14:18:26.0
Joint Industry Guideline Provides Best Practices for Measuring the Strain on Boards and Components During Manufacturing
Industry News | 2013-01-15 15:44:14.0
, IPC-2221B, Generic Standard on Printed Board Design, provides a basis for the design of all types of printed boards and addresses areas as diverse as testing, via protection, test coupon designs and surface finishes.
Industry News | 2009-04-15 23:12:38.0
BANNOCKBURN, Ill., USA, April 1, 2009 � IPC � IPC � Association Connecting Electronics Industries� presented Special Recognition, Distinguished Committee Leadership and Distinguished Committee Service awards at IPC APEX EXPO 2009, held March 31�April 2 in Las Vegas.
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