Industry News: structures (Page 5 of 84)

International Wafer-Level Packaging Conference (IWLPC) Features Five Half-Day Tutorials

Industry News | 2009-08-07 19:24:15.0

Minneapolis, MN – The SMTA and Chip Scale Review magazine are pleased to announce five half-day tutorials for the 6th Annual International Wafer-Level Packaging Conference. The IWLPC will be held October 27-30, 2009 at the Santa Clara Marriott Hotel in Santa Clara, California.

Surface Mount Technology Association (SMTA)

SMTA Announces IWLPC 2010 Featured Tutorials

Industry News | 2010-08-17 14:08:36.0

The SMTA and Chip Scale Review magazine are pleased to announce six half-day tutorials for the 7th Annual International Wafer-Level Packaging Conference.

Surface Mount Technology Association (SMTA)

Expanded Roadmap Track Announced For 2012 Pan Pacific Symposium

Industry News | 2011-07-14 11:46:04.0

SMTA is pleased to announce the expansion of the International Electronics Industry Roadmap track at the 2012 Pan Pacific Microelectronics Symposium at the Sheraton Poipu Resort in Kauai, HI, 14-16 February.

Surface Mount Technology Association (SMTA)

The SMTA Capital Chapter Invites You to Attend Its Annual Expo and Tech Forum on August 23, 2012

Industry News | 2012-08-09 18:20:49.0

The SMTA Capital Chapter is pleased to invite you to its upcoming Capital Expo and Tech Form at Johns Hopkins Applied Physics Lab, 11100 Johns Hopkins Road, Laurel, MD 20723, on August 23, 2012 from 9:00 am until 3:00 pm.

Surface Mount Technology Association (SMTA)

IPC and SMTA Announce the Agenda for Session 1 of the High-Reliability Cleaning and Coating Conference

Industry News | 2012-10-09 16:13:23.0

Industry-leading associations IPC and SMTA jointly announce the agenda for Session 1 of the High-Reliability Cleaning and Coating Conference, scheduled to take place November 13-15, 2012 at the Crowne Plaza Hotel – O’Hare in Chicago, IL.

Association Connecting Electronics Industries (IPC)

Gerry Partida, Summit Interconnect, to Present at SMTA Capital Chapter’s Expo and Tech Forum on August 24th

Industry News | 2017-08-06 19:39:48.0

The SMTA Capital Chapter is pleased to announce that Gerry Partida of Summit Interconnect, will present “Density, Advanced Materials and Cost Drivers Associated with Advanced Circuit Design, Fabrication and Assembly” at the upcoming Capital Expo and Tech Forum at Johns Hopkins University / Applied Physics Lab, Kossiakoff Center, on Thursday, August 24th.

Surface Mount Technology Association (SMTA)

International Wafer-Level Packaging Conference (IWLPC) Workshops

Industry News | 2017-08-29 15:41:30.0

The SMTA and Chip Scale Review are pleased to announce the Workshops for the 14th Annual International Wafer-Level Packaging Conference (IWLPC) held October 26th. IWLPC will be held October 24-26, 2017 at the DoubleTree Airport Hotel in San Jose, California.

Surface Mount Technology Association (SMTA)

IPC Urges U.S. Senate and House to Complete R&D Legislation Before August Recess

Industry News | 2022-07-25 08:18:26.0

IPC is encouraging the U.S. Senate and House to complete action on slimmed-down R&D legislation, following a Senate vote clearing the way for a vote in the coming days.

Association Connecting Electronics Industries (IPC)

IPC President and CEO Dr. John W. Mitchell Releases New Book, "Fire Your Hiring Habits"

Industry News | 2023-06-26 09:24:19.0

Content provides an in-depth look at the shift in today's hiring practices

Association Connecting Electronics Industries (IPC)

IPC Releases 2000/2001 Technology Roadmap

Industry News | 2001-02-13 08:23:07.0

IPC has announced the release of The 2000/2001 National Technology Roadmap for Electronic Interconnections. This roadmap provides a vision and direction for product development, process development and services required to satisfy the current and future needs of companies building electronic equipment.

Association Connecting Electronics Industries (IPC)


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