Industry News | 2003-04-08 10:28:06.0
A new range of high-performance press-fit D-subminiature terminations from GTK can be fitted easily to PCBs without the need for solder.
Industry News | 2014-06-22 19:12:37.0
MIRTEC, “The Global Leader in Inspection Technology,” will exhibit in Booth #5444-1 at SEMICON West 2014, scheduled to take place July 8-10 at the Moscone Center in San Francisco, CA.
Industry News | 2011-10-03 15:37:21.0
The SMTA announced a session on Challenges and Solutions for PCB Technology which will take place on Tuesday, October 18 during their annual conference, SMTA International
Industry News | 2015-01-15 19:44:09.0
SMTA and Chip Scale Review magazine announced the best papers from the 2014 International Wafer-Level Packaging Conference (IWLPC.) Winners were selected from each of the three tracks covering Wafer Level Packaging, 3-D (Stacked) Packaging, and MEMS Packaging, as well as an overall Best Paper and Best of Conference winner. IWLPC brings together some of the semiconductor industry's most respected authorities addressing all aspects of wafer-level, 3D, TSV, and MEMS device packaging.
Industry News | 2014-09-25 19:27:35.0
The world market for PCBs declined an estimated 2.2 percent in real terms in 2013, although real growth in North America was positive at 0.8 percent, according to IPC's World PCB Production Report for the Year 2013. Developed by a team of the world's leading PCB industry analysts, the annual study is the definitive source of PCB production data, indicating what kinds of PCBs are being made where. World PCB production in 2013 was valued at an estimated $59.4 billion.
Industry News | 2015-07-08 14:20:26.0
Nordson ASYMTEK, a Nordson company (NASDAQ: NDSN), a global leader in dispensing, jetting, and coating equipment and technologies, announces its new Programmable Tilt + Rotate 5-Axis Fluid Dispenser that enables the jet to dispense using 5 axes of automated control instead of only 3 axes. The additional X and Y tilt modes enable dispensing from a vertical position and at varying tilt angles along all four sides of a device and up the side of a substrate or component, especially for 3D packages, while meeting stringent requirements for precision, accuracy, and speed. It enables dispensing of underfill, encapsulant, and coating fluids around tall substrate components on PCBs, flexible circuits, and in densely populated boards; provides precision fluid delivery to multiple sides of the latest-generation mobile device cases and sub-component camera modules by moving the nozzle tip closer to a target location such as a vertical wall; and dispenses into tight corners and narrow gaps in advanced packages.
Industry News | 2009-09-09 20:01:40.0
SMTA China announces that the inauguration of the 2009-2010 SMTA China Executive Committee members was held at the SMTA China South 2009 Conference Award Presentation Ceremony, officiated by Tom Forsythe, Vice President of SMTA, and Dr. Chuck Bauer, International Chairman of SMTA, on Thursday, August 27, 2009 at the Shenzhen Ritz-Carlton Hotel in conjunction with the SMTA Hong Kong Chapter.
Industry News | 2011-04-20 21:24:46.0
In recognition of extraordinary contributions to IPC and the electronic interconnect industry, countless hours of volunteer service on IPC standards development committees and exceptional lifetime achievement, Don Dupriest, Lockheed Martin, was awarded the 2010 IPC Raymond E. Pritchard Hall of Fame Award. Presented at IPC APEX EXPO™ in Las Vegas, the Hall of Fame Award represents IPC’s highest level of member recognition.
Industry News | 2012-03-28 08:47:23.0
he industry standard that establishes the specific requirements for the design of flexible and rigid –flexible printed boards, IPC-2223, Sectional Design Standard for Flexible Printed Boards, has been recently updated to its C revision.
Industry News | 2015-09-30 10:16:51.0
The world market for printed circuit boards (PCBs) reached an estimated $60.2 billion in value in 2014, growing just 0.7 percent in real terms, according to IPC’s World PCB Production Report for the Year 2014. Production growth in China, Thailand and Vietnam compensated for declining PCB production in most other regions. Developed by a team of the world's leading PCB industry analysts, the annual study is the definitive source of PCB production data, indicating the volumes and types of PCBs being made in the world’s major producing countries.