Industry News | 2021-07-22 12:50:26.0
Latest investment enhances NY-based contract manufacturer's capabilities and quality for mixed-technology printed circuit board assembly
Industry News | 2018-10-18 20:03:31.0
$100 million. The award was presented to the company during a Tuesday, October 16, 2018 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International. NEO Tech is a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets.
Industry News | 2016-04-04 09:24:00.0
Vi TECHNOLOGY will exhibit in WKK’s Booth # 1F40 as well as First Technology’s Booth # 1G50, and American Tec’s Booth #1H45 at the upcoming NEPCON Shanghai, scheduled to take place April 26-28, 2016 at the Shanghai World Expo Exhibition and Convention Center in China.
Industry News | 2016-09-28 10:16:57.0
$100 million. The award was presented to the company during a Tuesday, Sept. 27, 2016 ceremony that took place at the Donald Stephens Convention Center in Rosemont, IL during SMTA International. NEO Tech is a leading provider of manufacturing technology and supply chain solutions for brand name OEMs in the industrial, medical and mil/aero markets.
Industry News | 2013-12-12 14:39:45.0
Express Manufacturing, Inc. (EMI) announces the implementation of a plan to expand support for their current and future customers from 2014. Developed as a response to customer feedback, this plan will address customer demand for high quality products with smaller packages and a shorter time-to-market.
Industry News | 2012-01-13 13:20:53.0
Zymet has introduced a new reworkable underfill encapsulant, CN-1736, designed to underfill 0.4-mm pitch Package-on-Package (POP) assemblies. It has low viscosity and a lower CTE than its predecessors. Plus it has greater flux compatibility, making it suitable for use with a broader range of solderpastes and tacky fluxes.
Industry News | 2014-03-04 11:29:02.0
Indium Corporation will feature its new high-melting lead-free solder paste technology, BiAgX™, at Semicon China on March 18-20 in Shanghai, China.
Industry News | 2018-11-20 06:46:05.0
The Electronics Interconnection Group’s webinars are now in their 8th year. The Group is internationally recognised for its practical and innovative work on lead-free reliability, PCB interconnection failures, tin whisker migration and conformal coating research http://www.npl.co.uk/science-technology/electronics-interconnection/webinars/
Industry News | 2021-11-12 04:07:03.0
Circuit Technology Center announces it has released an updated version of its popular Bonding System.
Industry News | 2019-10-29 02:58:23.0
Fast dehumidifying series dry cabinet announced!
