Industry News | 2018-08-16 20:05:44.0
Indium Corporation Research Chemist, Mary Ma, and Area Technical Manager for Eastern China, Wisdom Qu, will present their papers at the 2018 SMTA China South Technology Conference on Aug. 28 in Shenzhen, China. Their papers were voted by their peers as two of the top five “Best Papers” presented in recent years at SMTA South China and SMTA East China, earning them the opportunity to present them again at this year's show.
Industry News | 2017-02-07 15:46:59.0
The best technical conference paper of IPC APEX EXPO® 2017 has been selected. Voted on through a ballot process by members of the IPC APEX EXPO Technical Program Committee, the paper authors will receive their awards during the opening keynote session on Tuesday, February 14.
Industry News | 2014-11-18 18:10:25.0
Nordson DAGE, a division of Nordson Corporation (NASDAQ: NDSN) have adopted the company’s hot pin pull test method for checking the integrity of solder ball attach on packages and PCBs in accordance with the industry standard IPC9708. This particular standard provides guidelines for bond testing to identify potential pad craters.
Industry News | 2011-07-26 17:11:30.0
Nanovea introduced its patent pending breakthrough method of reliably acquiring yield strength through indentation; ultimately replacing the traditional tensile testing machine for yield strength measurement.
Industry News | 2014-07-28 13:56:52.0
240°C and novel stress absorbing capabilities to allow long-term reliability of large area flip-chip devices.
Industry News | 2024-09-23 20:42:25.0
Nihon Superior Co. Ltd. is pleased to announce that it will exhibit its TempSave series in Booth #2850 at the SMTA International Exposition, scheduled to take place October 22-24, 2024 at the Donald E. Stephen Convention Center in Rosemont, IL. The company also will showcase LF-C2 P608 solder paste.
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