Industry News | 2017-08-15 21:37:01.0
Pickering Interfaces will showcase their latest high-density PXI and Ethernet LXI Switching & Simulation Solutions at IEEE AUTOTESTCON, on September 12 - 14, 2017 in Schaumburg, IL. Below are the new products that will be introduced at the show:
Industry News | 2017-09-07 01:58:36.0
Pickering Interfaces will be introducing their new High-Density Modular LXI Ethernet Reed Relay Matrices at IEEE AUTOTESTCON in Schaumburg, IL, September 12-14, 2017.
Industry News | 2017-09-11 18:49:44.0
Pickering Interfaces will showcase their latest high-density PXI and Ethernet LXI Switching & Simulation Solutions at IEEE AUTOTESTCON, on September 12 - 14, 2017 in Schaumburg, IL. Below are the new products that will be introduced at the show:
Industry News | 2017-10-10 19:32:29.0
Pickering Interfaces will showcase their latest high-density PXI and Ethernet LXI Switching & Simulation at productronica 2017 in Munich, November 14th to 17th, Booth A1.452.
Industry News | 2021-09-30 16:18:08.0
Class is in session once again as Indium Corporation offers a new round of its successful test for industry professionals to measure their surface mount technology (SMT) knowledge. Organized byDr. Ron Lasky, senior technologist, the test offers prizes--and bragging rights--to those who get a high score.
Industry News | 2022-03-23 13:20:13.0
UK Manufacturer of test and measurement equipment for the electronics industry, GEN3 is working overtime to produce enough of its systems to meet the rapidly growing demand for both their AutoSIR2+ and AutoCAF2+ Systems.
Industry News | 2022-03-23 13:20:22.0
UK Manufacturer of test and measurement equipment for the electronics industry, GEN3 is working overtime to produce enough of its systems to meet the rapidly growing demand for both their AutoSIR2+ and AutoCAF2+ Systems.
Industry News | 2018-04-25 19:59:52.0
generation of solutions, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. Joining the The Next> series of test systems, first previewed last year at productronica will be Viva 6 Next>, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program.
Industry News | 2018-06-24 07:46:24.0
series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. This time it will be managed by Viva Next> 6, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program. In addition to the Seica OEM products described below Seica will also exhibit semiconductor solutions from Crea, OSAI and Microtest.
Industry News | 2018-07-02 21:34:21.0
series, the most versatile and performing flying probe system in the world, which represent yet another outstanding technological leap forward in Seica’s continuous “road” to innovation. This time it will be managed by Viva Next> 6, Seica’s latest evolution of its core management software platform, in a 64 bit version complete with a new graphical interface and a guided environment for creating test programs according to each specific requirement. The new platform continues to leverage its open architecture, further extending the capability of integration with third party software, such as TestStandTM, leaving programmers complete freedom to combine test sequences developed using various platforms in the same test program. In addition to the Seica OEM products described below Seica will also exhibit semiconductor solutions from Crea, OSAI and Microtest.