Industry News | 2020-09-17 12:23:10.0
Talk to the experts and see demonstrations of the latest equipment for test and inspection, fluid dispensing, and plasma treatment in one booth, #I2716
Industry News | 2003-05-15 08:02:52.0
IPC announces the release of two newly revised standards on solderability
Industry News | 2014-08-18 10:23:40.0
The IPC Solder Products Value Council (SPVC), in cooperation with iNEMI, has written a white paper, Analytical Procedures for Portable Lead-Free Alloy Test Data, that helps users determine which alloy characteristics best match their requirements.
Industry News | 2020-02-18 14:26:44.0
Deadline extended to February 21, 2020
Industry News | 2018-04-11 20:04:01.0
SMTA Europe announces Session 3 Technical Program on Advanced Test Methods at the “Electronics in Harsh Environments Conference” to be held in Amsterdam, Netherlands, on April 25th, 2018.
Industry News | 2021-09-26 13:06:24.0
Nordson TEST & INSPECTION division, part of the Nordson Corporation (Nasdaq: NDSN), are pleased to announce the launch of our X-ray Technologies OEM product range for industrial & pre-clinical X-ray imaging systems. This new product line is the result of several months of development work following the acquisition of vivaMOS, a leader in high resolution dynamic X-ray detectors.
Industry News | 2015-03-03 21:14:08.0
The SMTA and CALCE are pleased to announce the new LED Assembly, Reliability, and Test (A.R.T.) Symposium will take place November 17 - 19, 2015 at the Crowne Plaza Midtown in Atlanta, GA.
Industry News | 2019-03-10 20:30:11.0
The proliferation of tighter microvia densities and signal integrity requirements in printed boards within the electronics industry has revealed reliability concerns with microvia structures in high performance products. A number of IPC OEM member companies have approached IPC with examples of microvia failures in high-profile hardware that were not observed until after bare printed board fabrication, inspection and acceptance, including:
Industry News | 2023-04-17 08:38:56.0
IPC is now accepting abstracts for the High Reliability Forum, the international conference focusing on Class 3 and safety critical electronics for mil-aero, automotive, medical, and long-life applications that are subjected to harsh use environments. The High Reliability Forum will be held October 17-19, 2023, at the Hilton Baltimore BWI Airport in Linthicum (Baltimore), Md.
Association Connecting Electronics Industries (IPC)
